Jig for CAN-package semiconductor laser
A jig for handling a CAN-package semiconductor laser having a semiconductor laser mounted on a pedestal, a cap which is put on one surface of the pedestal and covers the semiconductor laser, and a lead pin which is electrically connected to the semiconductor laser and protrudes from the other surface of the pedestal includes: a base part provided with a recessed part to which the pedestal is fitted; a terminal pad provided on a recessed-part bottom surface and being in contact with the lead pin; and a terminal pin electrically connected to the terminal pad and protruding from the base part.
1. A jig for a CAN-package semiconductor laser, which is a jig for handling a CAN-package semiconductor laser having a semiconductor laser mounted on a pedestal, a cap which is put on one surface of the pedestal and covers the semiconductor laser, and a lead pin which is electrically connected to the semiconductor laser and protrudes from the other surface of the pedestal, the jig comprising:
a base part provided with a recessed part to which the pedestal is fitted;
a terminal pad provided on a bottom surface of the recessed part and being in contact with the lead pin;
a terminal pin electrically connected to the terminal pad and protruding from the base part;
a through hole which penetrates through the base part;
wherein, when the pedestal is fitted to the recessed part, at least a part of the through hole is covered with the pedestal; and
the through hole opens to opposite faces of the base part.
2. The jig for a CAN-package semiconductor laser according to claim 1 ,
wherein the recessed part has a height which exposes only the cap of the CAN-package semiconductor laser.
3. A jig for a CAN-package semiconductor laser, which is a jig for handling a CAN-package semiconductor laser having a semiconductor laser mounted on a pedestal, a cap which is put on one surface of the pedestal and covers the semiconductor laser, and a lead pin which is electrically connected to the semiconductor laser and protrudes from the other surface of the pedestal, the jig comprising:
a base part provided with a recessed part to which the pedestal is fitted;
a terminal pad provided on a bottom surface of the recessed part and being in contact with the lead pin;
a terminal pin electrically connected to the terminal pad and protruding from the base part; and
a positioning protrusion or a positioning groove which is provided on an inner side surface of the recessed part and engaged with the pedestal.
4. The jig for a CAN-package semiconductor laser according to claim 3 , further comprising:
a through hole which penetrates through the base part,
wherein, when the pedestal is fitted to the recessed part, at least a part of the through hole is covered with the pedestal.
5. The jig for a CAN-package semiconductor laser according to claim 4 ,
wherein the recessed part has a height which exposes only the cap of the CAN-package semiconductor laser.
6. The jig for a CAN-package semiconductor laser according to claim 4 ,
wherein the through hole is provided at a position facing the positioning protrusion or the positioning groove.
7. A jig for a CAN-package semiconductor laser, which is a jig for handling a CAN-package semiconductor laser having a semiconductor laser mounted on a pedestal, a cap which is put on one surface of the pedestal and covers the semiconductor laser, and a lead pin which is electrically connected to the semiconductor laser and protrudes from the other surface of the pedestal, the jig comprising:
a base part provided with a recessed part to which the pedestal is fitted;
a terminal pad provided on a bottom surface of the recessed part and being in contact with the lead pin;
a terminal pin electrically connected to the terminal pad and protruding from the base part; and
wherein an interval between the terminal pins is larger than an interval between the terminal pads.