IP Library Granted Patent US 9,411,240
Granted Patent B2
US 9,411,240 · App. 14/277,788 · Granted Aug 9, 2016

Method for compensating slit illumination uniformity

Inventor: Zhong-Gui Zhang (Singapore, SG)
Assignee: UNITED MICROELETRONICS CORPORATION
G03F7/70066G03F7/20G03F7/70083G03F7/70558
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Quick Facts
Patent No.
US 9,411,240
App. No.
14/277,788
Granted
Aug 9, 2016
Kind
B2
Abstract

A method for compensating a slit illumination uniformity includes executing a first lithography operation and recording an initial slit uniformity profile; executing a slit uniformity optimization process and recording an optimized slit uniformity profile; and offsetting the optimized slit uniformity profile to obtain a working slit uniformity profile such that the working slit uniformity profile has a mean value closest to that of the initial slit uniformity profile.

Claims (36)

1. A method for compensating a slit illumination uniformity associated with a lithographic apparatus, the lithographic apparatus including a radiation source, an illuminator, a patterning device, a projection system, a substrate table, and a correction module, comprising steps of:

executing a first lithography operation and recording an initial slit uniformity profile;

executing a slit uniformity optimization process and recording an optimized slit uniformity profile; and

executing an offsetting process for offsetting said optimized slit uniformity profile to obtain a working slit uniformity profile, wherein the difference between the mean values of said initial slit uniformity profile and said working slit uniformity profile is minimized.

2. A method according to claim 1 , wherein said offsetting process includes steps of:

offsetting said optimized slit uniformity profile under a specified ratio determined according to said initial slit uniformity profile and said optimized slit uniformity to obtain an automatically-calibrated slit uniformity profile;

comparing between said initial slit uniformity profile and said automatically-calibrated slit uniformity profile and finding a plurality of data points having the maximum difference value and the minimum difference value;

calculating a calibration factor according to said data points; and

offsetting said automatically-calibrated slit uniformity profile to said working slit uniformity profile according to said calibration factor.

3. A method according to claim 2 , wherein said automatically-calibrated slit uniformity profile is generated by an automatic calibration of a lithographic apparatus.

4. A method for performing a compensation of the slit illumination uniformity that is applied on a lithographic apparatus, comprises steps of:

generating at least one slit uniformity profile through said lithographic apparatus; and

finishing said compensation of the slit illumination uniformity by referring to said at least one slit uniformity profile, wherein

said at least one slit uniformity profile includes a first slit uniformity profile and a second slit uniformity profile, wherein said first slit uniformity profile and said second slit uniformity profile are respectively generated before and after a slit uniformity optimization of said lithographic apparatus, and wherein

said at least one slit uniformity profile further includes a third slit uniformity profile, wherein said third slit uniformity profile is obtained by offsetting said second slit uniformity profile according to said first slit uniformity profile and said second slit uniformity profile.

5. The method according to claim 4 , wherein the value of a compensation factor is calculated according to said first slit uniformity profile and said third silt uniformity profile, and the slit illumination uniformity compensation of said lithography apparatus is performed according to said compensation factor.

6. A method for compensating a slit illumination uniformity that is applied on a lithographic apparatus, comprising steps of:

executing a first lithography operation and recording an initial slit uniformity profile;

executing a slit uniformity optimization process and recording an optimized slit uniformity profile; and

executing an offsetting process for offsetting said optimized slit uniformity profile to obtain a working slit uniformity profile, wherein the difference between the mean values of said initial slit uniformity profile and said working slit uniformity profile is minimized.

7. The method according to claim 6 , wherein said offsetting process includes steps of:

offsetting said optimized slit uniformity profile under a specified ratio determined according to said initial slit uniformity profile and said optimized slit uniformity to obtain an automatically-calibrated slit uniformity profile;

comparing between said initial slit uniformity profile and said automatically-calibrated slit uniformity profile and finding a plurality of data points having the maximum difference value and the minimum difference value;

calculating a calibration factor according to said data points; and

offsetting said automatically-calibrated slit uniformity profile to said working slit uniformity profile according to said calibration factor.

8. The method according to claim 7 , wherein said automatically-calibrated slit uniformity profile is generated by an automatic calibration of a lithographic apparatus.

9. A method for compensating a slit illumination uniformity, that is applied on a lithographic apparatus, the lithographic apparatus including a patterning device, and the patterning device is providing a pattern, which is transferred onto a surface of a substrate, comprising steps of:

executing a first lithography operation and recording an initial slit uniformity profile;

executing a slit uniformity optimization process and recording an optimized slit uniformity profile; and

executing an offsetting process for offsetting said optimized slit uniformity profile to obtain a working slit uniformity profile, wherein the difference between the mean values of said initial slit uniformity profile and said working slit uniformity profile is minimized.

10. The method according to claim 9 , wherein said offsetting process includes steps of:

offsetting said optimized slit uniformity profile under a specified ratio determined according to said initial slit uniformity profile and said optimized slit uniformity to obtain an automatically-calibrated slit uniformity profile;

comparing between said initial slit uniformity profile and said automatically-calibrated slit uniformity profile and finding a plurality of data points having the maximum difference value and the minimum difference value;

calculating a calibration factor according to said data points; and

offsetting said automatically-calibrated slit uniformity profile to said working slit uniformity profile according to said calibration factor.

11. The method according to claim 10 , wherein said automatically-calibrated slit uniformity profile is generated by an automatic calibration of a lithographic apparatus.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: ZHANG, ZHONG-GUI
To: UNITED MICROELECTRONICS CORPORATION
Reel/Frame 032891/0442 →
Continuity (1)
Related Publication 20150331328A1 · Nov 19, 2015