IP Library Granted Patent US 9,438,980
Granted Patent B2
US 9,438,980 · App. 14/548,744 · Granted Sep 6, 2016

Headphone ear cup

Inventors: Chung-Yi Huang (Taichung, TW); Chih-Feng Chao (Taichung, TW); Yu-Jen Cho (Taichung, TW)
Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
H04R1/10H04R1/1008H04R1/1083H04R5/033H04R2201/105H04R2460/15
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Quick Facts
Patent No.
US 9,438,980
App. No.
14/548,744
Granted
Sep 6, 2016
Kind
B2
Abstract

A headphone ear cup for mounting on a surface of a speaker unit of a headphone includes an annular cushion having a sound hole at a center thereof, and a composite cover having a ventilative layer and an air-tight layer. The composite cover wraps around the annular cushion and defines an inner-side portion, an outer-side portion and an ear-abutting portion. The ventilative and air-tight layers are respectively formed by the outer-side portion and a composite of the inner-side and ear-abutting portions or by a composite of the outer-side and ear-abutting portions and the inner-side portion. Therefore, the ventilative layer and the annular cushion form a good heat dissipation path to have excellent air-permeable property, and air-tight layer provides an improved acoustic field effect.

Claims (29)

1. A headphone ear cup, comprising:

an annular cushion provided at a center thereof with a sound hole; and

a composite cover having a ventilative layer and an air-tight layer, and wrapping around the annular cushion to define an inner-side portion surrounding the sound hole, an outer-side portion opposite to the inner-side portion spacedly and remote from the sound hole, and an ear-abutting portion connected between the outer-side portion and the inner-side portion;

wherein the ventilative layer has an air permeability higher than that of the air-tight layer, the ventilative layer is formed by the outer-side portion and the ear-abutting portion, and the air-tight layer is formed by the inner-side portion;

wherein the ventilative layer and the air-tight layer are made from different material.

2. The headphone ear cup as defined in claim 1 , wherein the outer-side portion and the ear-abutting portion are made of a same material.

3. The headphone ear cup as defined in claim 1 , wherein the annular cushion has an annular body and at least one air-permeable portion arranged at an outer periphery of the annular body; two sides of the at least one air-permeable portion are connected to the ear-abutting portion and the outer-side portion, respectively; the at least one air-permeable portion is made of a porous material having a density lower than that of the annular body.

4. The headphone ear cup as defined in claim 3 , wherein the annular body of the annular cushion is abutted with the inner-side portion.

5. The headphone ear cup as defined in claim 3 , wherein the air-permeable portion of the annular cushion has an annular shape and surrounds around the sound hole.

6. The headphone ear cup as defined in claim 5 , wherein the air-permeable portion of the annular cushion is abutted with the annular body.

7. A headphone ear cup for disposing on a headphone, the headphone ear cup comprising:

an annular cushion provided at a center thereof with a sound hole; and

a composite cover having a ventilative layer and an air-tight layer, and wrapping around the annular cushion to define an inner-side portion surrounding the sound hole, an outer-side portion opposite to the inner-side portion spacedly and remote from the sound hole, and an ear-abutting portion connected between the outer-side portion and the inner-side portion;

wherein the ventilative layer has an air permeability higher than that of the air-tight layer, the ventilative layer is formed by the outer-side portion, and the air-tight layer is formed by the inner-side portion and the ear-abutting portion;

wherein the ventilative layer and the air-tight layer are made from different material.

8. The headphone ear cup as defined in claim 7 , wherein the inner-side portion and the ear-abutting portion are made of a same material.

9. The headphone ear cup as defined in claim 7 , wherein the annular cushion has an annular body and at least one air-permeable portion arranged at an outer periphery of the annular body; two sides of the at least one air-permeable portion are connected to the ear-abutting portion and the outer-side portion, respectively; the at least one air-permeable portion is made of a porous material having a density lower than that of the annular body.

10. The headphone ear cup as defined in claim 9 , wherein the annular body of the annular cushion is abutted with the inner-side portion.

11. The headphone ear cup as defined in claim 9 , wherein the air-permeable portion of the annular cushion has an annular shape and surrounds around the sound hole.

12. The headphone ear cup as defined in claim 11 , wherein the air-permeable portion of the annular cushion is abutted with the annular body.

13. A headphone ear cup, comprising:

an annular cushion provided at a center thereof with a sound hole; and

a composite cover having a ventilative layer and an air-tight layer, and wrapping around the annular cushion to define an inner-side portion surrounding the sound hole, an outer-side portion opposite to the inner-side portion spacedly and remote from the sound hole, and an ear-abutting portion connected between the outer-side portion and the inner-side portion;

wherein the ventilative layer has an air permeability higher than that of the air-tight layer, the ventilative layer is formed by the outer-side portion and the ear-abutting portion, and the air-tight layer is formed by the inner-side portion; and wherein the annular cushion has an annular body and at least one air-permeable portion arranged at an outer periphery of the annular body; two sides of the at least one air-permeable portion are connected to the ear-abutting portion and the outer-side portion, respectively; the at least one air-permeable portion is made of a porous material having a density lower than that of the annular body.

14. A headphone ear cup for disposing on a headphone, the headphone ear cup comprising:

an annular cushion provided at a center thereof with a sound hole; and

a composite cover having a ventilative layer and an air-tight layer, and wrapping around the annular cushion to define an inner-side portion surrounding the sound hole, an outer-side portion opposite to the inner-side portion spacedly and remote from the sound hole, and an ear-abutting portion connected between the outer-side portion and the inner-side portion;

wherein the ventilative layer has an air permeability higher than that of the air-tight layer, the ventilative layer is formed by the outer-side portion, and the air-tight layer is formed by the inner-side portion and the ear-abutting portion, and

wherein the annular cushion has an annular body and at least one air-permeable portion arranged at an outer periphery of the annular body; two sides of the at least one air-permeable portion are connected to the ear-abutting portion and the outer-side portion, respectively; the at least one air-permeable portion is made of a porous material having a density lower than that of the annular body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2014
From: HUANG, CHUNG-YI; CHAO, CHIH-FENG; CHO, YU-JEN
To: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
Reel/Frame 034219/0356 →
Continuity (1)
Related Publication 20160150307A1 · May 26, 2016