IP Library Granted Patent US 9,439,307
Granted Patent B2
US 9,439,307 · App. 14/286,233 · Granted Sep 6, 2016

Laminated punched sheet metal electronic enclosure/shield with integrated gaskets

Inventors: M. David Swafford (Gaston, OR); Marcus K. Da Silva (Portland, OR); Steve U. Reinhold (Hillsboro, OR)
Assignee: TEKTRONIX, INC.
H05K5/0217H05K5/04H05K9/0033H05K9/0037
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Quick Facts
Patent No.
US 9,439,307
App. No.
14/286,233
Granted
Sep 6, 2016
Kind
B2
Abstract

An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.

Claims (16)

1. An assembly suitable for housing electronic components, the assembly comprising:

a top shield;

a bottom shield coupled with the top shield, the bottom shield including:

a conductive outer cover;

a wall section; and

a laminating portion between the conductive outer cover and the wall section, the laminating portion comprising laminating material that substantially covers a surface of the conductive outer cover;

a printed circuit board (PCB) positioned between the top shield and the bottom shield; and

at least one mechanical hardware component configured to provide proper spacing between the wall section of the bottom shield and the PCB.

2. The assembly of claim 1 , wherein the wall section is a conductive punched wall section.

3. The assembly of claim 1 , wherein the conductive outer cover is made of punched aluminum.

4. The assembly of claim 1 , wherein the wall section is constructed from aluminum.

5. The assembly of claim 1 , wherein the laminating material includes at least one from a group consisting of: double-sided conductive adhesive, aluminum solder paste, aluminum solder preforms, conductive epoxy, and sheet gasket with double-sided adhesive.

6. The assembly of claim 1 , further comprising at least one mechanical fastener configured to trap a gasket or gasket-like material between the conductive outer cover and the wall section.

7. The assembly of claim 6 , wherein the at least one mechanical fastener includes at least one from a group consisting of: rivets, spot welds, screws, and PEM hardware.

8. The assembly of claim 6 , wherein gasket-like material includes at least one from a group consisting of: dimpled sheet gasket, woven screen, sheet gasket, and dielectric absorber.

9. The assembly of claim 1 , wherein the wall section includes at least one clearance cavity punched therein to provide extra space for at least one component on the PCB.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2014
From: SWAFFORD, M. DAVID; DA SILVA, MARCUS K.; REINHOLD, STEVE U.
To: TEKTRONIX, INC.
Reel/Frame 033122/0655 →
Continuity (2)
Provisional Application 61936585 · Feb 6, 2014
Related Publication 20150223357A1 · Aug 6, 2015