Transistor having metal diffusion barrier
A transistor includes a substrate, a channel layer over the substrate, an active layer over the channel layer, a metal diffusion barrier over the active layer, and a gate over the metal diffusion barrier. The active layer has a band gap discontinuity with the channel layer.
1. A semiconductor device, comprising:
a channel layer;
an active layer over the channel layer, wherein the active layer has a band gap discontinuity with the channel layer that causes a 2-DEG to form;
a dielectric layer over the active layer, the dielectric layer having a gap over the active layer;
a p-GaN layer over the active layer and in the gap;
an n-GaN layer over the p-GaN layer;
a barrier layer over the dielectric layer and the n-GaN layer; and
a gate over the barrier layer.
2. The semiconductor device of claim 1 , further comprising:
a source electrode over the channel layer, the source electrode at a first side of the gate; and
a drain electrode over the channel layer, the drain electrode at a second side of the gate opposite the first side of the gate.
3. The semiconductor device of claim 1 , wherein the n-GaN layer is entirely within the gap.
4. A transistor comprising:
a substrate;
a nucleation layer over the substrate;
a graded layer over the nucleation layer;
a channel layer over the graded layer;
an active layer over the channel layer, wherein the active layer has a band gap discontinuity with the channel layer that causes a 2-DEG to form;
source and drain electrodes over the active layer;
a dielectric layer over the source and drain electrodes and over a portion of the active layer, the dielectric layer having a gap over the active layer;
a p-GaN layer over the active layer and in the gap;
an n-GaN layer over the p-GaN layer;
a barrier layer over the dielectric layer and the n-GaN layer; and
a gate over the barrier layer.
5. The transistor of claim 4 , wherein at least some of the active layer is between the source electrode and the channel layer, and at least some of the active layer is between the drain electrode and the channel layer.
6. The transistor of claim 5 , wherein the p-GaN layer has a thickness ranging from about 75 nanometers (nm) to about 100 nm.
7. A transistor comprising:
a substrate;
a channel layer over the substrate;
an active layer over the channel layer, wherein the active layer has a band gap discontinuity with the channel layer;
a dielectric layer over the active layer, wherein the dielectric layer exposes a portion of the active layer;
a metal diffusion barrier over the exposed portion of the active layer, wherein a portion of the metal diffusion barrier is over the dielectric layer; and
a gate over the metal diffusion barrier.
8. The transistor of claim 7 , wherein the metal diffusion barrier further comprises:
a p-GaN layer over the portion of the active layer;
an n-GaN layer over the p-GaN layer; and
a barrier layer over the dielectric layer and the n-GaN layer, the barrier layer including aluminum nitride (AlN).
9. The transistor of claim 7 , wherein a top portion of the substrate is doped with p-type dopants to a dopant concentration ranging from about 1×10 18 ions/cm 3 to about 1×10 23 ions/cm 3 .
10. The transistor of claim 7 ,
wherein the dielectric layer defines a gap, at least a portion of the metal diffusion barrier being in the gap.
11. The transistor of claim 7 , further comprising:
a source electrode over the channel layer, the source electrode at a first side of the gate;
a drain electrode over the channel layer, the drain electrode at a second side of the gate, wherein the band gap discontinuity causes a two dimensional electron gas (2-DEG) to form and wherein the gate is configured to control a conductivity of the 2-DEG between the source electrode and the drain electrode.
12. The transistor of claim 7 , wherein the metal diffusion barrier further comprises:
a p-type gallium nitride (p-GaN) layer over the exposed portion of the active layer.
13. The transistor of claim 12 , wherein the p-GaN layer has a thickness ranging from about 75 nanometers (nm) to about 100 nm.
14. The transistor of claim 7 , wherein the metal diffusion barrier further comprises:
an n-type gallium nitride (n-GaN) layer over the exposed portion of the active layer.
15. The transistor of claim 14 , wherein the n-GaN layer has a thickness ranging from about 10 nm to about 30 nm.
16. The transistor of claim 7 , wherein the metal diffusion barrier further comprises:
a barrier layer over the dielectric layer and the exposed portion of the active layer.
17. The transistor of claim 16 , wherein the barrier layer has a thickness ranging from about 5 angstroms (Å) to about 30 Å.
18. The transistor of claim 7 , further comprising:
a nucleation layer between the substrate and the channel layer.
19. The transistor of claim 18 , further comprising:
a graded layer between the nucleation layer and the channel layer.
20. The transistor of claim 19 , wherein the graded layer comprises:
a first graded layer including Al x Ga 1-x N, where x ranges from 0.7 to 0.9;
a second graded layer on the first graded layer, the second graded layer including Al y Ga 1-y N, where y ranges from 0.4 to 0.6; and
a third graded layer on the second graded layer, the third graded layer including Al z Ga 1-z N, where z ranges from 0.15 to 0.3.