Process for forming light-emitting diodes
The invention relates to a process for manufacturing light-emitting diodes comprising the following steps: a) forming light-emitting diodes ( 5 ) on a silicon layer ( 1 ) of an SOI wafer ( 1, 2, 3 ), said layer resting on a carrier ( 2, 3 ); b) bonding, on the light-emitting diode side, a silicon wafer forming a cap ( 7 ) equipped with a void facing each light-emitting diode; c) thinning the silicon wafer to form an aperture facing each light-emitting diode; d) filling each aperture with a transparent material ( 21, 23 ); and e) at least partially removing the carrier of the SOI wafer ( 3 ) and producing connecting and heat-sinking metallizations.
1. A light-emitting diode manufacturing method comprising the steps of:
a) forming light-emitting diodes on a silicon layer of an SOI-type wafer, said layer resting on a support;
b) bonding on the light-emitting diode side a silicon wafer forming a cap provided with a non-through recess opposite each light-emitting diode;
c) leveling down the bonded silicon wafer to form a through opening opposite each light-emitting diode;
d) filling each opening with a transparent material; and
e) at least partially removing the support of the SOI-type wafer from the entire SOI-type wafer and forming connection and heat sink metallizations.
2. The method of claim 1 , wherein steps c), d), and e) follow one another.
3. The method of claim 1 , wherein at least the removal of the support of the SOI-type wafer of step e) is carried out before steps c) and d).
4. The method of claim 1 , further comprising a step of cutting into individual light-emitting diodes or into groups of light-emitting diodes.
5. The method of claim 1 , wherein the lateral surfaces of each recess of the silicon wafer forming a cap are coated with a reflective deposit.
6. The method of claim 1 , wherein the light-emitting diodes are nanowire light-emitting diodes.
7. The method of claim 6 , wherein the nanowires are GaN nanowires.
8. The method of claim 7 , wherein the nanowires are formed from a seed layer deposited on the silicon layer.
9. The method of claim 1 , wherein the filling of the openings is performed with a transparent material provided with phosphors in its portion close to the light-emitting diodes.
10. The method of claim 1 , wherein the external surface of the filling material is shaped to have desired optical characteristics.
11. The method of claim 1 , wherein the support of the SOI-type wafer comprises a handle and an insulating layer interposed between the handle and the silicon layer and wherein, at step (e), the handle is totally removed.