VCSEL array for a depth camera
Various embodiments relating to a time-of-flight (TOF) depth camera including a vertical-cavity surface emitting laser (VCSEL) array device are disclosed. In one embodiment, a TOF depth camera includes a heat sink having a mounting surface, an illumination module mounted to the mounting surface, and an image sensor mounted to the mounting surface. The illumination module includes a printed circuit board (PCB), a VCSEL array device configured to generate illumination light to illuminate an image environment, and a driver configured to deliver an operating current to the VCSEL array device. The VCSEL array device and the driver are mounted to the PCB. The image sensor is configured to detect at least a portion of illumination light reflected from the image environment.
1. A time-of-flight (TOF) depth camera configured to collect image data from an image environment illuminated by illumination light, the TOF depth camera comprising:
a heat sink having a mounting surface;
an illumination module mounted to the mounting surface of the heat sink, the illumination module including
a printed circuit board (PCB),
a vertical-cavity surface emitting laser (VCSEL) array device configured to generate illumination light to illuminate the image environment, the VCSEL array device being mounted to the PCB, the VCSEL array device including a VCSEL chip, a submount including an anode and a cathode positioned on a same side of the submount, and a stiffener layer, wherein the VCSEL chip is bonded to the cathode and electrically connected to the anode via a plurality of bonding wires, and wherein the stiffener layer is positioned between the submount and the mounting surface of the heat sink, and
a driver configured to deliver an operating current to the VCSEL array device, the driver being mounted to the PCB and electrically connected to the VCSEL array device via the PCB; and
an image sensor mounted to the mounting surface of the heat sink, the image sensor configured to detect at least a portion of illumination light reflected from the image environment.
2. The TOF depth camera of claim 1 , wherein the PCB is mounted between the heat sink and the VCSEL array device.
3. The TOF depth camera of claim 2 , wherein the PCB is made of a material having a thermal conductivity greater than 2 W/(m-K).
4. The TOF depth camera of claim 1 , wherein the PCB has a first side oriented to face the mounting surface of the heat sink, a second side that opposes the first side, and an opening extending through the PCB between the first side and the second side, and wherein the VCSEL array device is mounted to the first side of the PCB and emits the illumination light through the opening.
5. The TOF depth camera of claim 4 , wherein the submount has a first side, wherein the VCSEL array device includes a plurality of soldering pads, and wherein the VCSEL chip and the plurality of soldering pads are coupled between the first side of the submount and the first side of the PCB.
6. The TOF depth camera of claim 4 , wherein the PCB is made of a material having a thermal conductivity less than 2 W/(m-K).
7. The TOF depth camera of claim 1 , wherein the VCSEL array device generates illumination light as a pulse train of at least 100 microsecond pulses repeating every millisecond.
8. A time-of-flight (TOF) depth camera configured to collect image data from an image environment illuminated by illumination light, the TOF depth camera comprising:
a heat sink having a mounting surface;
an illumination module mounted to the mounting surface of the heat sink, the illumination module including
a printed circuit board (PCB) having a first side oriented to face the mounting surface of the heat sink, a second side that opposes the first side, and an opening extending through the PCB between the first side and the second side,
a vertical-cavity surface emitting laser (VCSEL) array device configured to generate illumination light to illuminate the image environment, the VCSEL array device being mounted to the first side of the PCB and emitting the illumination light through the opening, the VCSEL array device including a VCSEL chip, a submount including an anode and a cathode positioned on a same side of the submount, and a stiffener layer, wherein the VCSEL chip is bonded to the cathode and electrically connected to the anode via a plurality of bonding wires, and wherein the stiffener layer is positioned between the submount and the mounting surface of the heat sink, and
a driver configured to deliver an operating current to the VCSEL array device, the driver being mounted to first side of the PCB and electrically connected to the VCSEL array device via the PCB; and
an image sensor mounted to the mounting surface of the heat sink, the image sensor configured to detect at least a portion of illumination light reflected from the image environment.
9. The TOF depth camera of claim 8 , wherein the submount has a first side, wherein the VCSEL array device includes a plurality of soldering pads, and wherein the VCSEL chip and the plurality of soldering pads are coupled between the first side of the submount and the first side of the PCB.
10. The TOF depth camera of claim 8 , wherein the PCB is made of material having a thermal conductivity less than 2 W/(m-K).
11. The TOF depth camera of claim 8 , wherein the VCSEL array device generates illumination light as a pulse train of at least 100 microsecond pulses repeating every millisecond.
12. A time-of-flight (TOF) depth camera configured to collect image data from an image environment illuminated by illumination light, the TOF depth camera comprising:
a heat sink having a mounting surface;
an illumination module mounted to the mounting surface of the heat sink, the illumination module including
a printed circuit board (PCB) having a first side oriented to face the mounting surface of the heat sink, a second side that opposes the first side, and an opening extending through the PCB between the first side and the second side,
a vertical-cavity surface emitting laser (VCSEL) array device configured to generate illumination light to illuminate the image environment, the VCSEL array device being mounted to the first side of the PCB and emitting the illumination light through the opening, the VCSEL array device includes a VCSEL chip, a submount including an anode and a cathode positioned on a same side of the submount, and a stiffener layer, wherein the VCSEL chip is bonded to the cathode and electrically connected to the anode via a plurality of bonding wires, and wherein the stiffener layer is positioned between the submount and the mounting surface of the heat sink, and
a driver configured to deliver an operating current to the VCSEL array device, the driver being mounted to the first side of the PCB and electrically connected to the VCSEL array device via the PCB;
an image sensor mounted to the mounting surface of the heat sink, the image sensor configured to detect at least a portion of illumination light reflected from the image environment;
a storage machine holding instructions; and
a logic machine configured to execute the instructions to
generate depth information about the object based upon image information generated by the image sensor from detected illumination light, and
output the depth information to a computing device.
13. The TOF depth camera of claim 12 , wherein the submount has a first side, wherein the VCSEL array device further includes a plurality of soldering pads, and wherein the VCSEL chip and the plurality of soldering pads are coupled between the first side of the submount and the first side of the PCB.