Universal IC tag, method of manufacturing same, and communication management system
A universal IC tag comprises a metal sheet M 1 having a hollow slot functioning as an antenna; plastic sheets laminated on the front and the rear surfaces of the metal sheet M 1 ; an IC arranged in the hollow slot, and a metal sheet M 2 laminated on the rear plastic sheet having a reflecting amplifying function. Such universal IC tag can transmits/receive maximum energy by matching IC impedance with slot impedance and by attaining resonance between an IC capacitor and a slot inductance.
1. A universal IC tag comprising:
a metal sheet M 1 ;
a cutout formed in said metal sheet M 1 with a length shorter than a width of said metal sheet M 1 ;
an IC arranged in said cutout, and
a metal sheet M 2 arranged in parallel to said metal sheet M 1 via an insulating body, wherein:
said cutout radiates radio wave;
a transmission line formed by said metal sheet M 1 and metal sheet M 2 ;
further comprising metal sheet M 3 , and metal sheet M 4 ,
wherein said metal sheet M 1 and said metal sheet M 2 are short-circuited by said metal sheet M 3 , and said metal sheet M 4 at positions in a direction perpendicular to said cutout, and
a theoretical impedance from said cutout formed in said metal sheet (M 1 ) to said metal sheet (M 2 ) is configured to be infinite.
2. A universal IC tag comprising:
a metal sheet M 1 ;
metal sheets M 2 arranged at a rear side of said metal sheet M 1 via an insulating body; and
metal sheets M 5 at the rear side of said metal sheet M 2 via said insulating body, wherein:
a cutout is formed in said metal sheets M 2 ,
an IC is arranged in said cutout, and
openings are formed in said metal sheets M 1 , M 5 at positions corresponding to said cutout formed in said metal sheet M 2 wherein:
a theoretical impedance from said cutout formed in said metal sheet M 2 to said metal sheet M 1 or said metal sheet M 5 is configured to be infinite.
3. The universal IC tag according to claim 1 , wherein:
an opening is formed in said metal sheet M 2 at a position corresponding to said cutout.
4. The universal IC tag according to claim 1 or claim 2 , wherein:
said cutout has a shape selected from the group consisting of a slot, an H shape, a slot having additional slots with zigzag shape at both ends, a bow tie shape, or a reentrant shape.
5. The universal IC tag according to claim 1 or claim 2 , wherein:
a plurality of openings of said metal sheets M 1 , M 2 , M 5 are arranged so as to attain a directivity gain.
6. The universal IC tag according to claim 1 or claim 2 , wherein:
said IC is connected to said cutout via an impedance matching circuit.
7. The universal IC tag according to claim 1 or claim 2 , wherein:
an adhesive sheet is attached to one side of said universal IC tag, or said universal IC tag is attached to a band via attaching metal part.
8. The universal IC tag according to claim 1 or claim 2 , wherein:
a portion of said metal sheet which is directly contacted to a metal surface, is rendered bare, or a portion of said metal sheet which is directly contacted to a metal surface, is rendered in a state of capacitive short by a thin insulating film.
9. The universal IC tag according to claim 1 or claim 2 , wherein:
said universal IC tag is used for managing, pursuing, controlling or recording objects, humans and animals.
10. A manufacturing method of the universal IC tags specified in claim 1 , or claim 2 , comprising steps of:
punching cutouts with a predetermined distance apart in a long metal sheet;
laminating plastic films on one surface or both surfaces of said punched metal sheet;
arranging ICs in said cutouts during the laminating step, and
cutting the laminated composite sheets into pieces so as to obtain individual universal IC tags.
11. A communication management system for managing and controlling the universal IC tags specified in claim 1 or claim 2 , or objects to which said universal IC tags are attached, wherein:
the communication management system accesses computers and servers via a network or said objects are processed, selected or stored based on data stored in the universal IC tags.
12. The communication management system according to claim 11 , wherein:
managing and controlling procedures are performed via Internet communication.
13. The universal IC tag according to claim 1 , further comprising:
a substrate for mounting said IC, wherein:
said substrate is arranged across said cutout formed in said metal sheet M 1 , and
power supply terminals for supplying power to said IC are arranged on said substrate.
14. The universal IC tag according to claim 2 , wherein:
said metal sheets M 1 , said metal sheet M 2 and said metal sheet M 5 are short-circuited at a position in a direction perpendicular to said cutout and apart ¼ wave electric length from a center of said cutout.
15. A universal IC tag comprising:
a metal sheet M 1 ;
a cutout formed in said metal sheet M 1 with a length shorter than a width of said metal sheet M 1 ;
an IC arranged in said cutout, and
a metal sheet M 2 arranged in parallel to said metal sheet M 1 via an insulating body,
a metal sheet M 5 at a rear side of said metal sheet M 2 via said insulating body,
a cutout is formed in said metal sheets M 2 ,
a metal sheet M 5 at a rear side of said metal sheet M 2 via said insulating body, wherein:
said cutout radiates radio wave;
a transmission line formed by said metal sheet M 1 and metal sheet M 2 ;
a theoretical impedance from said cutout formed in said metal sheet (M 1 ) to said metal sheet (M 2 ) is configured to be infinite, wherein:
respective ICs are arranged in openings formed in the metal sheets M 1 , M 2 , M 5 , and
different signals are received by said respective ICs.