Electronic board provided with a liquid cooling system
An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h 1 ; a cold plate that extends parallel to the support, the distance between the cold plate and the support being equal to the first threshold height h 1 , the cold plate including a base plate in which at least one channel is formed through which a coolant can circulate, the base plate being fixed to a complementary plate closing the channel, the cold plate covers all first electronic components, the first electronic components being connected to the cold plate through deformable pads made of a heat conducting material.
1. An electronic board comprising;
a support on which first electronic components, second electronic components and third electronic components are fixed, the first electronic components having a height of less than a first threshold height, the second electronic components having a height between the first threshold height and a second threshold height greater than the first threshold height, and the third electronic components having a height greater than the second threshold height; and
a cold plate that extends parallel to the support, the distance between the cold plate and the support being equal to the first threshold height, the cold plate comprising a base plate in which at least one channel is formed through which a coolant is able to circulate, the base plate being fixed to a complementary plate closing the channel, wherein the cold plate covers all the first electronic components, the first electronic components being connected to the cold plate through deformable pads made of a heat conducting material,
wherein the cold plate is pierced by non-through openings inside which the second electronic components are inserted, the second electronic components being connected to the cold plate through deformable pads made of a heat conducting material,
wherein the cold plate is pierced by through openings, in which the third electronic components are inserted, the electronic board further comprising additional heat dissipaters connecting the third electronic components and the cold plate.
2. The electronic board according to claim 1 , wherein the cold plate has outside dimensions equal to the support dimensions.
3. The electronic board according to claim 1 , wherein the channel goes around through openings and/or the non-through openings of the cold plate.
4. The electronic board according to claim 1 , wherein a distance between the support and the channel is constant.
5. The electronic board according to claim 1 , wherein the cold plate is fixed to the support such that the deformable pads are compressed between the electronic components and the cold plate.
6. The electronic board according to claim 1 , further comprising one or several additional printed circuit boards, the cold plate being located between the support and the additional printed circuit(s), and an additional cold plate located between the cold plate and the additional printed circuit(s).
7. A rackable server comprising an electronic board according to claim 1 .