Laser processing system using broad band pulsed lasers
A laser material processing system which includes a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser emitted from one core of an optical fiber, where the broad band laser is applied to a subject material to produce removal of the subject material and/or color change of the subject material.
1. A laser material processing system comprising:
a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser being emitted
wherein:
all wavelengths are emitted from the same core of said fiber laser source;
the broad band laser is configured to be applied to a subject material to produce removal of the subject material and/or color change of the subject material.
2. The laser material processing system of claim 1 , wherein said laser material processing system is configured to be applied to a polymeric material.
3. The laser material processing system of claim 2 , wherein said polymeric material is selected from the group consisting of polystyrene and polymethylmethacrylate.
4. The laser material processing system of claim 1 , wherein said laser material processing system is configured to be applied to an inorganic glass oxide.
5. The laser material processing system of claim 1 , wherein said laser material processing system is configured to be applied to a semiconductor material.