Light-emitting structure and a method for fabricating the same

1. A method for fabricating a light-emitting structure, comprising:

providing a carrier having at least one LED die disposed on a surface thereof;

forming a uniform phosphor layer in a mold cavity of a first mold;

covering the at least one LED die with the uniform phosphor layer, wherein an accommodation space is constituted by the carrier and the mold cavity of the first mold;

forming a first light-pervious body in the accommodation space to be combined with the uniform phosphor layer; and

removing the first mold, wherein the uniform phosphor layer is formed on a surface of the first light-pervious body.

2. The method of claim 1 , wherein the uniform phosphor layer comprises phosphor powders and a binder material.

3. The method of claim 2 , wherein the phosphor powders in the uniform phosphor layer occupy more than 75% in volume of the uniform phosphor layer.

4. The method of claim 1 , wherein the uniform phosphor layer comprises phosphor powders constituted by a plurality of phosphor particles, none of which is completely separated from adjacent ones.

5. The method of claim 1 , further comprising, after removal of the mold, forming a second light-pervious body on the uniform phosphor layer, wherein the uniform phosphor layer is sandwiched between the first light-pervious body and the second light-pervious body.

6. The method of claim 1 , wherein a second light-pervious body is formed on a surface of the mold cavity of the first mold, and the uniform phosphor layer is formed on a surface of the second light-pervious body, such that, after the first light-pervious body is formed, the uniform phosphor layer is sandwiched between the first light-pervious body and the second light-pervious body.

7. The method of claim 6 , wherein the second light-pervious body is formed by:

providing a second mold having the uniform phosphor layer formed on a surface thereof;

molding and forming the second light-pervious body on the uniform phosphor layer with the first mold; and

removing the second mold, wherein the second light-pervious body is sandwiched between the uniform phosphor layer and the surface of the first mold.

8. The method of claim 6 , further comprising a connection part that surrounds the uniform phosphor layer, and is disposed on the carrier after the uniform phosphor layer covers the at least one LED die.

9. The method of claim 1 , wherein the uniform phosphor layer has a portion that covers the at least one LED die and is in contact with the carrier.

10. A light-emitting structure, comprising:

a carrier;

at least one LED die provided on the carrier;

a first light-pervious body formed on the carrier and covering the at least one LED die; and

a uniform phosphor layer provided on the first light-pervious body and covering the at least one LED die, wherein the uniform phosphor layer has a laterally extending portion in contact with the carrier, and the uniform phosphor layer is formed by using an electrostatic charge process, such that the phosphor powders in the uniform phosphor layer occupy more than 75% in volume of the uniform phosphor layer.

11. The light-emitting structure of claim 10 , wherein the uniform phosphor layer comprises phosphor powders and a binder material.

12. The light-emitting structure of claim 10 , wherein the uniform phosphor layer comprises phosphor powders constituted by a plurality of phosphor particles, none of which is completely separated from adjacent ones.

13. The light-emitting structure of claim 10 , further comprising a second light-pervious body formed on the uniform phosphor layer, wherein the uniform phosphor layer is sandwiched between the first light-pervious body and the second light-pervious body.

14. The light-emitting structure of claim 13 , wherein the second light-pervious body is free from being in contact with the carrier.