IP Library Granted Patent US 9,483,969
Granted Patent B2
US 9,483,969 · App. 14/006,087 · Granted Nov 1, 2016

Liquid crystal panel, and testing circuit and testing method thereof

Inventor: Jinjie Wang (Shenzhen, CN)
Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
G09G3/006G09G3/3648
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Quick Facts
Patent No.
US 9,483,969
App. No.
14/006,087
Granted
Nov 1, 2016
Kind
B2
Abstract

A liquid crystal panel, the testing circuit and the testing method thereof are disclosed. The testing circuit includes shorting bars, bonding pads, and switches. The switches are arranged between the shorting bars and the bonding pads. In the testing process, the switches are turn on upon receiving the testing signals so as to transmit the testing signals from the shorting bars to the bonding pads. When the testing process ends, the switches are turn off to prevent the liquid crystal panel from being affected by the signals of the bonding pads during the normal screen display of the liquid crystal panel. In this way, the manufacturing cost is reduced.

Claims (30)

1. A testing circuit of a liquid crystal panel, comprising:

the liquid crystal panel comprises a display area, and the testing circuit is arranged in a peripheral of the display area, the testing circuit comprises:

a scanning side testing circuit being arranged at a scanning side and a data side testing circuit being arranged at a data line side, both of the scanning side testing circuit and the data side testing circuit comprising a plurality of shorting bars, two ends of the shorting bar couple testing bonding pads so as to obtain testing signals from the testing bonding pads;

a plurality of bonding pads comprising scanning chips bonding pads and data chips bonding pads, the scanning chips bonding pads being arranged within the scanning side testing circuit, the data chips bonding pads being arranged within the data side testing circuit, one end of the bonding pads couples with the shorting bar, and the other end of the bonding pads couples a display area of the liquid crystal panel so as to transmit the testing signals to the display area;

wherein at least one set of switches is arranged between the bonding pads and the shorting bars, the switches are turn on upon receiving the testing signals, and then transmit the testing signals from the shorting bars to the bonding pads in a testing process, and the switches are turn off when the testing process ends so as to prevent the liquid crystal panel from being affected by the signals of the bonding pads when the liquid crystal panel displays normally;

wherein two additional bonding pads are respectively arranged on two ends of the bonding pad, and turn-off signals are inputted to the additional bonding pads and are transmitted to the shorting bars so as to turn off the switches after the testing process ends.

2. The testing circuit as claimed in claim 1 , wherein the switch is a thin film transistor (TFT).

3. The testing circuit as claimed in claim 2 , wherein one end of the scanning chips bonding pad connects to a source of the TFT, and a gate and a drain of the TFT connect to the shorting bar.

4. The testing circuit as claimed in claim 3 , wherein the shorting bar comprises a first shorting bar and a second shorting bar, one end of the data chips bonding pad connects to the source of the TFT, the gate of the TFT connects to the first shorting bar, and the drain of the TFT connects to the second shorting bar.

5. The testing circuit as claimed in claim 4 , wherein the additional bonding pads connect to the first shorting bar.

6. The testing circuit as claimed in claim 2 , wherein the testing circuit comprises one TFT set, the gate and the drain of the TFT connect to the shorting bar, and the source of the TFT connects to the corresponding bonding pads.

7. The testing circuit as claimed in claim 2 , wherein the testing circuit comprises a plurality of TFT sets, a number of the switches is the same with the number of the bonding pads, the gate and the drain of the TFT connect to the shorting bar, and the source of the TFT connects to the corresponding bonding pads.

8. A liquid crystal panel, comprising:

a display area and a testing circuit arranged in a peripheral of the display area the testing circuit comprises:

a scanning side testing circuit being arranged at a scanning side and a data side testing circuit being arranged at a data line side, both of the scanning side testing circuit and the data side testing circuit comprising a plurality of shorting bars, two ends of the shorting bar couple testing bonding pads so as to obtain testing signals from the testing bonding pads;

a plurality of bonding pads comprising scanning chips bonding pads and data chips bonding pads, the scanning chips bonding pads being arranged within the scanning side testing circuit, the data chips bonding pads being arranged within the data side testing circuit, one end of the bonding pads couples with the shorting bar, and the other end of the bonding pads couples a display area of the liquid crystal panel so as to transmit the testing signals to the display area;

wherein at least one set of switches is arranged between the bonding pads and the shorting bars, the switches are turn on upon receiving the testing signals, and then transmit the testing signals from the shorting bars to the bonding pads in a testing process, and the switches are turn off when the testing process ends so as to prevent the liquid crystal panel from being affected by the signals of the bonding pads when the liquid crystal panel displays normally;

wherein two additional bonding pads are respectively arranged on two ends of the bonding pad, and turn-off signals are inputted to the additional bonding pads and are transmitted to the shorting bars so as to turn off the switches after the testing process ends.

9. The liquid crystal panel as claimed in claim 8 , wherein the switch is a thin film transistor (TFT).

10. The liquid crystal panel as claimed in claim 9 , wherein one end of the scanning chips bonding pad connects to a source of the TFT, and a gate and a drain of the TFT connect to the shorting bar.

11. The liquid crystal panel as claimed in claim 10 , wherein the shorting bar comprises a first shorting bar and a second shorting bar, one end of the data chips bonding pad connects to the source of the TFT, the gate of the TFT connects to the first shorting bar, and the drain of the TFT connects to the second shorting bar.

12. The liquid crystal panel as claimed in claim 11 , wherein the additional bonding pads connect to the first shorting bar.

13. The liquid crystal panel as claimed in claim 9 , wherein the testing circuit comprises one TFT set, the gate and the drain of the TFT connect to the shorting bar, and the source of the TFT connects to the corresponding bonding pads.

14. The liquid crystal panel as claimed in claim 9 , wherein the testing circuit comprises a plurality of TFT sets, a number of the switches is the same with the number of the bonding pads, the gate and the drain of the TFT connect to the shorting bar, and the source of the TFT connects to the corresponding bonding pads.

15. A testing method of a liquid crystal panel, comprising;

arranging at least one set of switch between shorting bars and bonding pads of a scanning side testing circuit being arranged at a scanning side and of a data side testing circuit being arranged at a data line side of the liquid crystal panel, the bonding pads comprising scanning chips bonding pads and data chips bonding pads, the scanning chips bonding pads being arranged within the scanning side testing circuit, the data chips bonding pads being arranged within the data side testing circuit;

providing testing signals to the shorting bars to turn on the switches;

transmitting the testing signals to a display area of the liquid crystal panel after the testing signals enter the bonding pads via the switches;

providing turn-off signals to the switches when a testing process ends so as to prevent the liquid crystal panel from being affected by the signals of the bonding pads while the liquid crystal panel displays normally; and

wherein when the providing step further comprises arranging additional bonding pads on two ends of the switch such that the additional bonding pads input turn-off signals to turn off the switches when the testing process ends, and wherein a number of the switches is the same with the number of the bonding pads.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2013
From: WANG, JINJIE
To: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 031235/0965 →
Priority Claims (1)
CN 2013 1 02472341 · Jun 20, 2013 · national
Continuity (1)
Related Publication 20140375344A1 · Dec 25, 2014