LED structures for reduced non-radiative sidewall recombination
LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
1. A light emitting diode (LED) comprising:
a p-n diode layer including:
a top current spreading layer;
a bottom current spreading layer;
an active layer between the top current spreading layer and the bottom current spreading layer; and
p-n diode layer sidewalls spanning the top current spreading layer, the active layer, and the bottom current spreading layer;
wherein lateral edges of the active layer are internally confined inside the p-n diode layer sidewalls.
2. The light emitting diode of claim 1 , further comprising an intermixed passivation region surrounding the active layer and within the p-n diode layer sidewalls.
3. The light emitting diode of claim 2 , wherein the intermixed passivation region comprises a higher bandgap energy than the active layer.
4. The light emitting diode of claim 3 , wherein the wherein the intermixed passivation region comprises a p-dopant selected from the group consisting of Zn and Mg.
5. The light emitting diode of claim 2 , further comprising a top cladding layer and a bottom cladding layer on opposite sides of the active layer, and the intermixed passivation region comprises an alloy of the top cladding layer, the active layer, and the bottom cladding layer.
6. The light emitting diode of claim 2 , wherein the wherein the intermixed passivation region comprises a species selected from the group consisting of Fe, Cr, and Ni.
7. The light emitting diode of claim 2 , wherein the active layer comprises InGaP, and the intermixed passivation region comprises an alloy of AlInGaP surrounding the active layer.
8. The light emitting diode of claim 1 , wherein the active layer comprises a phosphorous based semiconductor.
9. The light emitting diode of claim 8 , wherein the lateral edges of the active layer are displaced into an interior of the LED by notching followed by surface conversion of surrounding layers.
10. The light emitting diode of claim 1 , wherein the active layer comprises a nitride based semiconductor.
11. The light emitting diode of claim 10 , wherein the lateral edges of the active layer are displaced into an interior of the LED by mass transport.
12. A light emitting diode (LED) comprising:
a p-n diode layer including:
a top current spreading layer;
a bottom current spreading layer;
an active layer between the top current spreading layer and the bottom current spreading layer;
p-n diode layer sidewalls spanning the top current spreading layer, the active layer, and the bottom current spreading layer; and
a diffused passivation layer within the p-n diode layer sidewalls.
13. The light emitting diode of claim 12 , wherein the diffused passivation layer comprises a p-dopant.
14. The light emitting diode of claim 13 , wherein the diffused passivation layer is within sidewalls of the top current spreading layer, the bottom current spreading layer, and the active layer, the top current spreading layer is doped with an n-type dopant, and the diffused passivation layer within the top current spreading layer is net p-type.
15. The light emitting diode of claim 12 , further comprising:
a top cladding layer and a bottom cladding layer on opposite sides of the active layer;
wherein the diffused passivation layer is within sidewalls of the top current spreading layer, the top cladding layer, the active layer, the bottom cladding layer, and the bottom current spreading layer.
16. The light emitting diode of claim 12 , wherein the active layer comprises a phosphorous based semiconductor.
17. The light emitting diode of claim 12 , wherein the diffused passivation layer comprises a species selected from the group consisting of Fe, Cr, and Ni.
18. A light emitting diode (LED) comprising:
a p-n diode layer including:
a top current spreading layer;
a bottom current spreading layer;
an active layer between the top current spreading layer and the bottom current spreading layer, wherein the active layer is phosphorus based; and
p-n diode layer sidewalls spanning the top current spreading layer, the active layer, and the bottom current spreading layer; and
an AlInP passivation layer laterally surrounding the p-n diode layer sidewalls.
19. The light emitting diode of claim 18 , wherein the active layer comprises a phosphorous based semiconductor.
20. The light emitting diode of claim 19 , wherein the diffused passivation layer comprises a p-dopant.