Sequential circuit and semiconductor device
The following semiconductor device provides high reliability and a narrower frame width. The semiconductor device includes a driver circuit and a pixel portion. The driver circuit has a first transistor including a first gate and a second gate electrically connected to each other with a semiconductor film sandwiched therebetween, and a second transistor electrically connected to the first transistor. The pixel portion includes a third transistor, a liquid crystal element, and a capacitor. The liquid crystal element includes a first transparent conductive film electrically connected to the third transistor, a second conductive film, and a liquid crystal layer. The capacitor includes the first conductive film, a third transparent conductive film, and a nitride insulating film. The nitride insulating film is positioned between the first transparent conductive film and the third transparent conductive film, and positioned between the semiconductor film and the second gate of the first transistor.
1. A semiconductor device comprising:
a first insulating film comprising a nitride;
a driver circuit comprising:
a first transistor including a first gate, a second gate, a semiconductor film between the first gate and the second gate, a second insulating film, and a third insulating film comprising a nitride, each of the second insulating film and the third insulating film between the second gate and the semiconductor film; and
a second transistor; and
a pixel portion comprising:
a third transistor;
a liquid crystal element comprising:
a first transparent conductive film electrically connected to the third transistor;
a first conductive film over the first transparent conductive film; and
a liquid crystal layer between the first transparent conductive film and the first conductive film; and
a capacitor comprising:
a second transparent conductive film;
the first transparent conductive film over the second transparent conductive film; and
the third insulating film between the first transparent conductive film and the second transparent conductive film, the third insulating film is in contact with the second transparent conductive film,
wherein a first portion of the first insulating film comprises the second insulating film and the third insulating film over the second insulating film,
wherein a second portion of the first insulating film comprises the third insulating film in the capacitor,
wherein the first gate of the first transistor is electrically connected to the second gate of the first transistor,
wherein one of a source and a drain of the first transistor is configured to receive a first potential,
wherein one of a source and a drain of the second transistor is configured to receive a second potential,
wherein the second potential is lower than the first potential, and
wherein the other of the source and the drain of the second transistor is electrically connected to the other of the source and the drain of the first transistor.
2. The semiconductor device according to claim 1 ,
wherein the one of the source and the drain of the first transistor is further configured to receive the second potential, and
wherein the one of the source and the drain of the first transistor is configured to receive the first potential and the second potential alternately.
3. The semiconductor device according to claim 1 , wherein each of a first channel formation region of the first transistor, a second channel formation region of the second transistor and a third channel formation region of the third transistor comprises an oxide semiconductor film.
4. The semiconductor device according to claim 3 , wherein the oxide semiconductor film comprises In, Zn and O.
5. The semiconductor device according to claim 1 , wherein the first insulating film comprises a height difference between the first portion of the first insulating film and the second portion of the first insulating film.
6. The semiconductor device according to claim 1 , wherein the second transparent conductive film comprises In, Zn and O.
7. The semiconductor device according to claim 3 , wherein end portions of the oxide semiconductor film of the first transistor overlap the first gate of the first transistor and the second gate of the first transistor in a channel width direction.
8. The semiconductor device according to claim 1 , wherein the first transistor has a channel length greater than or equal to 0.5 μm, and less than or equal to 4.5 μm.
9. A semiconductor device comprising:
a first insulating film comprising a nitride;
a driver circuit comprising:
a first transistor including a first gate, a second gate, a semiconductor film between the first gate and the second gate, a second insulating film, and a third insulating film comprising a nitride, each of the second insulating film and the third insulating film between the second gate and the semiconductor film; and
a second transistor;
a pixel portion comprising:
a third transistor;
a liquid crystal element comprising:
a first transparent conductive film electrically connected to the third transistor;
a first conductive film over the first transparent conductive film; and
a liquid crystal layer between the first transparent conductive film and the first conductive film; and
a capacitor comprising:
a second transparent conductive film;
the first transparent conductive film over the second transparent conductive film; and
the third insulating film between the first transparent conductive film and the second transparent conductive film, the third insulating film is in contact with the second transparent conductive film,
wherein a first portion of the first insulating film comprises the second insulating film and the third insulating film over the second insulating film,
wherein a second portion of the first insulating film comprises the third insulating film in the capacitor,
wherein the first gate of the first transistor is electrically connected to the second gate of the first transistor,
wherein the second gate of the first transistor is in contact with the first insulating film,
wherein the first transparent conductive film is in contact with the first insulating film,
wherein one of a source and a drain of the first transistor is configured to receive a first potential,
wherein one of a source and a drain of the second transistor is configured to receive a second potential,
wherein the second potential is lower than the first potential, and
wherein the other of the source and the drain of the second transistor is electrically connected to the other of the source and the drain of the first transistor.
10. The semiconductor device according to claim 9 ,
wherein the one of the source and the drain of the first transistor is further configured to receive the second potential, and
wherein the one of the source and the drain of the first transistor is configured to receive the first potential and the second potential alternately.
11. The semiconductor device according to claim 9 , wherein each of a first channel formation region of the first transistor, a second channel formation region of the second transistor and a third channel formation region of the third transistor comprises an oxide semiconductor film.
12. The semiconductor device according to claim 10 , wherein the oxide semiconductor film comprises In, Zn and O.
13. The semiconductor device according to claim 10 , wherein the first insulating film comprises a height difference between the first portion of the first insulating film and the second portion of the first insulating film.
14. The semiconductor device according to claim 9 , wherein the second transparent conductive film comprises In, Zn and O.
15. The semiconductor device according to claim 10 , wherein end portions of the oxide semiconductor film of the first transistor overlap the first gate of the first transistor and the second gate of the first transistor in a channel width direction.
16. The semiconductor device according to claim 9 , wherein the first transistor has a channel length greater than or equal to 0.5 μm, and less than or equal to 4.5 μm.
17. The semiconductor device according to claim 9 , wherein the second gate of the first transistor and the first transparent conductive film comprise the same material.
18. The semiconductor device according to claim 1 , wherein the second insulating film comprises an opening in the second portion of the first insulating film.
19. The semiconductor device according to claim 9 , wherein the second insulating film comprises an opening in the second portion of the first insulating film.
20. A semiconductor device comprising:
a first insulating film comprising a nitride;
a driver circuit comprising:
a first transistor including a first gate, a second gate, a semiconductor film between the first gate and the second gate, a second insulating film, and a third insulating film comprising a nitride, each of the second insulating film and the third insulating film between the second gate and the semiconductor film; and
a second transistor; and
a pixel portion comprising:
a third transistor;
a liquid crystal element comprising:
a first transparent conductive film electrically connected to the third transistor;
a first conductive film over the first transparent conductive film; and
a liquid crystal layer between the first transparent conductive film and the first conductive film; and
a capacitor comprising:
the first transparent conductive film;
a second transparent conductive film;
the first transparent conductive film over the second transparent conductive film; and
the third insulating film between the first transparent conductive film and the second transparent conductive film, the third insulating film is in contact with the second transparent conductive film,
wherein a first portion of the first insulating film comprises the second insulating film and the third insulating film over the second insulating film,
wherein a second portion of the first insulating film comprises the third insulating film in the capacitor,
wherein the first gate of the first transistor is electrically connected to the second gate of the first transistor,
wherein the second gate of the first transistor is in contact with the first insulating film,
wherein the first transparent conductive film is in contact with the first insulating film, and
wherein one of a source and a drain of the second transistor is electrically connected to one of a source and a drain of the first transistor.
21. The semiconductor device according to claim 20 , wherein each of a first channel formation region of the first transistor, a second channel formation region of the second transistor and a third channel formation region of the third transistor comprises an oxide semiconductor film.
22. The semiconductor device according to claim 21 , wherein the oxide semiconductor film comprises In, Zn and O.
23. The semiconductor device according to claim 21 , wherein the second transparent conductive film comprises In, Zn and O.
24. The semiconductor device according to claim 21 , wherein end portions of the oxide semiconductor film of the first transistor overlap the first gate of the first transistor and the second gate of the first transistor in a channel width direction.