Electronic component and method for producing same
An electronic component comprises: a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers. A plurality of first lead-out conductors are exposed between the insulator layers at the mounting surface. A first external electrode covers the first lead-out conductors at the mounting surface. The first external electrode is located at a first formation area at the mounting surface. The first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, is curved so as to bulge at a center of the formation area relative to opposite ends thereof.
1. An electronic component comprising:
a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers;
a plurality of first lead-out conductors exposed between the insulator layers at the mounting surface;
a first external electrode covering the first lead-out conductors at the mounting surface;
a plurality of second lead-out conductors exposed between the insulator layers at the mounting surface; and
a second external electrode covering the second lead-out conductors at the mounting surface,
the first external electrode being located at a first formation area at the mounting surface, and
the first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, being curved so as to bulge at a center of the first formation area relative to opposite ends thereof.
2. The electronic component according to claim 1 , further comprising a circuit element including a plurality of conductive members.
3. The electronic component according to claim 2 , wherein,
in a cross section normal to the extending direction and including the first lead-out conductors and the conductive members, a part of the cross section is a first cross-sectional region including the first lead-out conductors and the mounting surface, and the rest of the cross section other than the first cross-sectional region is a second cross-sectional region including the conductive members,
a proportion of an area occupied by the first lead-out conductors in the first cross-sectional region is greater than the proportion of an area occupied by the conductive members in the second cross-sectional region.
4. The electronic component according to claim 2 , wherein a part of the first lead-out conductors is provided outside of opposite ends of the circuit element in a direction of lamination of the plurality of rectangular insulator layers.
5. The electronic component according to claim 4 , wherein the part of the first lead-out conductor provided outside the opposite ends of the circuit element is thicker than the first lead-out conductor provided inside the opposite ends of the circuit element in the direction of lamination.
6. The electronic component according to claim 4 , wherein a height from the mounting surface to a top of one first lead-out conductor provided outside the opposite ends of the circuit element in the direction of lamination is greater than a height from the mounting surface to a top of one first lead-out conductor provided inside the opposite ends of the circuit element in the direction of lamination.
7. The electronic component according to claim 2 , wherein each of the first lead-out conductors is thicker than each of the conductive members.
8. The electronic component according to claim 2 , wherein one insulator layer provided outside opposite ends of the circuit element in a direction of lamination of the plurality of rectangular insulator layers is thinner than one insulator layer provided inside the opposite ends of the circuit element in the direction of lamination.
9. The electronic component according to claim 1 ,
wherein the first external electrode and the second external electrode are arranged in the extending direction.
10. The electronic component according to claim 9 , wherein, in a plan view in the extending direction, a distance in a direction normal to the mounting surface from the most bulging point of the mounting surface to the opposite ends of the mounting surface is from 0.15 μm to 12.5 μm.
11. The electronic component according to claim 1 , wherein the first external electrode is formed by plating.
12. The electronic component according to claim 1 , wherein the laminate is sintered.
13. The electronic component according to claim 1 , wherein
the second external electrode is located at a second formation area at the mounting surface, and
the second formation area, when viewed in a plan view in the extending direction, is curved so as to bulge at a center of the second formation area relative to opposite ends thereof.
14. A method for producing an electronic component including a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers;
a plurality of first lead-out conductors exposed between the insulator layers at the mounting surface;
a first external electrode covering the first lead-out conductors at the mounting surface;
a plurality of second lead-out conductors exposed between the insulator layers at the mounting surface; and
a second external electrode covering the second lead-out conductors at the mounting surface,
the first external electrode being located at a first formation area at the mounting surface, and
the first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, being curved so as to bulge at a center of the first formation area relative to opposite ends thereof, and
a circuit element including a plurality of conductive members, comprising steps of:
obtaining the laminate in an unfired state, the laminate being provided with the first lead-out conductors and the conductive members; and
firing the laminate.
15. An electronic component comprising:
a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers,
a plurality of first lead-out conductors exposed between the insulator layers at the mounting surface,
a first external electrode covering the first lead-out conductors at the mounting surface,
a plurality of second lead-out conductors exposed between the insulator layers at the mounting surface,
a second external electrode covering the second lead-out conductors at the mounting surface,
the first external electrode being provided in a first formation area at the mounting surface, and
the first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, being curved so as to bulge at a center relative to opposite ends of the first formation area,
a second formation area, when viewed in the plan view, being curved so as to bulge at a center relative to opposite ends of the second formation area.
16. The electronic component according to claim 15 , further comprising a circuit element including a plurality of conductive members.
17. An electronic component comprising:
a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers;
a plurality of first lead-out conductors exposed between the insulator layers at the mounting surface; and
a first external electrode covering the first lead-out conductors at the mounting surface,
the first external electrode being located at a first formation area at the mounting surface, and
the first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, being curved so as to bulge at a center of the first formation area relative to opposite ends thereof, wherein
in a cross section normal to the extending direction and including the first lead-out conductors and the conductive members, a part of the cross section is a first cross-sectional region including the first lead-out conductors and the mounting surface, and the rest of the cross section other than the first cross-sectional region is a second cross-sectional region including the conductive members,
a proportion of an area occupied by the first lead-out conductors in the first cross-sectional region is greater than the proportion of an area occupied by the conductive members in the second cross-sectional region.
18. An electronic component comprising:
a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers;
a plurality of first lead-out conductors exposed between the insulator layers at the mounting surface;
a first external electrode covering the first lead-out conductors at the mounting surface,
the first external electrode being located at a first formation area at the mounting surface, and
the first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, being curved so as to bulge at a center of the first formation area relative to opposite ends thereof; and
a circuit element including a plurality of conductive members; wherein
a part of the first lead-out conductors is provided outside of opposite ends of the circuit element in a direction of lamination of the plurality of rectangular insulator layers, and
the part of the first lead-out conductor provided outside the opposite ends of the circuit element is thicker than the first lead-out conductor provided inside the opposite ends of the circuit element in the direction of lamination.
19. An electronic component comprising:
a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers;
a plurality of first lead-out conductors exposed between the insulator layers at the mounting surface;
a first external electrode covering the first lead-out conductors at the mounting surface,
the first external electrode being located at a first formation area at the mounting surface, and
the first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, being curved so as to bulge at a center of the first formation area relative to opposite ends thereof; and
a circuit element including a plurality of conductive members; wherein
one insulator layer provided outside opposite ends of the circuit element in a direction of lamination of the plurality of rectangular insulator layers is thinner than one insulator layer provided inside the opposite ends of the circuit element in the direction of lamination.
20. An electronic component comprising:
a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers;
a plurality of first lead-out conductors exposed between the insulator layers at the mounting surface;
a first external electrode covering the first lead-out conductors at the mounting surface,
the first external electrode being located at a first formation area at the mounting surface, and
the first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, being curved so as to bulge at a center of the first formation area relative to opposite ends thereof; and
a circuit element including a plurality of conductive members; wherein
a part of the first lead-out conductors is provided outside of opposite ends of the circuit element in a direction of lamination of the plurality of rectangular insulator layers, and
a height from the mounting surface to a top of one first lead-out conductor provided outside the opposite ends of the circuit element in the direction of lamination is greater than a height from the mounting surface to a top of one first lead-out conductor provided inside the opposite ends of the circuit element in the direction of lamination.