IP Library Granted Patent US 9,510,776
Granted Patent B2
US 9,510,776 · App. 14/360,493 · Granted Dec 6, 2016

Shoe insole sensor for walk diagnosis and shoe insole flexible board combined with the same

Inventor: Jin-Wook Lee (Seoul, KR)
A61B5/1116A43B3/0005A61B5/1036A61B5/112A61B5/6807A61B5/6829
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Quick Facts
Patent No.
US 9,510,776
App. No.
14/360,493
Granted
Dec 6, 2016
Kind
B2
Abstract

A shoe insole sensor includes a body including a plurality of recessed regions formed at respective locations corresponding to vertexes of N-polygon, where N is an even number, a plurality of first protrusions formed in odd recessed regions of the recessed regions, where each of the first protrusions has a first height, and a plurality of second protrusions formed in even recessed regions of the recessed regions, where each of the second protrusions has a second height different from the first height. Here, the body is formed with a nonconductive material, each of the first protrusions is formed with a conductive material, and each of the second protrusions is formed with a conductive material.

Claims (8)

1. A shoe insole sensor comprising:

a body including a plurality of recessed regions formed at respective locations corresponding to vertexes of N-polygon, where N is an even number greater than 2, the body being formed with a nonconductive material;

a plurality of first protrusions formed in odd recessed regions of the recessed regions, each of the first protrusions having a first height, each of the first protrusions being formed with a conductive material; and

a plurality of second protrusions formed in even recessed regions of the recessed regions, each of the second protrusions having a second height different from the first height, each of the second protrusions being formed with a conductive material,

wherein the first protrusions and the second protrusions that are adjacent to each other act as respective sensing pairs, and the sensing pairs implement data resolution based on the first height and the second height.

2. The sensor of claim 1 , wherein the body has a cylinder shape.

3. The sensor of claim 1 , wherein each of the recessed regions has a cylinder shape, each of the first protrusions has the cylinder shape, and each of the second protrusions has the cylinder shape.

4. The sensor of claim 1 , wherein the conductive material includes conductive rubber and the nonconductive material includes nonconductive rubber.

Priority Claims (1)
KR 10-2011-0125516 · Nov 29, 2011 · national
Continuity (1)
Related Publication 20140326085A1 · Nov 6, 2014