Prober
A prober includes: a wafer chuck having a conductive support surface; a movement rotation mechanism which moves and rotates the wafer chuck; a head stage which holds a probe holding portion; a stage member which has a conductive stage surface that is formed in parallel to the support surface and electrically connected with the support surface, and can move integrally with the wafer chuck; and a contactor which is fixed to a position facing the stage member and whose tip can electrically come into contact with the stage surface, wherein the stage member is separated from the wafer chuck as a separate body, and the stage surface and the support surface are electrically connected through a wiring member; and a back-surface electrode of a chip is electrically connected with a tester through the wafer chuck, a wiring, the stage member and the contactor.
1. A prober comprising:
a wafer chuck which holds a wafer on which multiple chips having an electrode in each surface are formed and has a conductive support surface which can come into contact with a back-surface electrode of a chip;
a movement rotation mechanism which moves and rotates the wafer chuck;
a head stage which holds a probe holding portion having a probe that comes into contact with a front-surface electrode of the chip and connects the front-surface electrode with a terminal of a tester to electrically inspect the chip;
a stage member which has a conductive stage surface that is formed in parallel to the support surface and electrically connected with the support surface, and can move integrally with the wafer chuck; and
a contactor which is disposed in a position facing the stage member and whose tip can electrically come into contact with the stage surface, wherein:
the stage member is separated from the wafer chuck as a separate body, and the stage surface and the support surface are electrically connected through a wiring member; and
the back-surface electrode of the chip is electrically connected with the tester through the wafer chuck, the wiring member, the stage member and the contactor.
2. The prober according to claim 1 , wherein the wafer chuck includes a heating and cooling mechanism which heats or cools the wafer held in the wafer chuck.
3. The prober according to claim 1 , wherein the stage member is configured such that the contactor can always come into contact with the stage surface when the probe comes into contact with the front-surface electrode of the chip in a movable range of the wafer chuck.
4. The prober according to claim 1 , wherein the contactor is formed with a spring pin.
5. The prober according to claim 1 , wherein the contactor is formed with a contactor having a probe card-like shape.
6. The prober according to claim 1 , wherein the contactor is fixed to the head stage.
7. The prober according to claim 1 , wherein the contactor is fixed to the probe holding portion.
8. The prober according to claim 1 , wherein the contactor is disposed as contactor groups formed with multiple contactors which are adjacent to each other, and the contactor groups are disposed at predetermined intervals.