IP Library Granted Patent US 9,558,982
Granted Patent B2
US 9,558,982 · App. 14/030,728 · Granted Jan 31, 2017

Minimal contact edge ring for rapid thermal processing

Inventors: Heng Pan (Santa Clara, CA); Sairaju Tallavarjula (Santa Clara, CA); Kevin J. Bautista (San Jose, CA); Jeffrey Tobin (Mountain View, CA)
Assignee: APPLIED MATERIALS, INC.
H01L21/6835H01L21/67115H01L21/67248H01L21/68735
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Quick Facts
Patent No.
US 9,558,982
App. No.
14/030,728
Granted
Jan 31, 2017
Kind
B2
Abstract

Embodiments of the disclosure generally relate to a support ring that supports a substrate in a process chamber. In one embodiment, the support ring comprises an inner ring, an outer ring connecting to an outer perimeter of the inner ring through a flat portion, an edge lip extending radially inwardly from an inner perimeter of the inner ring to form a supporting ledge, and a substrate support extending upwardly from a top surface of the edge lip. The substrate support may be a continuous ring-shaped body disposed around a circumference of the edge lip. The substrate support supports a substrate about its entire periphery from the back side with minimized contact surface to thermally disconnect the substrate from the edge lip. Particularly, the substrate support provides a substantial line contact with the back surface of the substrate.

Claims (26)

1. A substrate support ring, comprising

a ring body;

an edge lip that extends radially from a surface of the ring body; and

a substrate support that extends upwardly from a top surface of the edge lip, wherein the substrate support is a continuous ring-shaped body disposed along a circumference of the edge lip, and the substrate support comprises a substrate contact surface having a radial width of about 5 μm to about 200 μm.

2. The substrate support ring of claim 1 , wherein the substrate support has a height of about 0.5 mm to about 3 mm.

3. The substrate support ring of claim 1 , wherein the substrate contact surface has a shape selected from the group consisting of hemispherical, rhombus, and triangular.

4. The substrate support ring of claim 1 , wherein the radial width is about 50 μm.

5. A substrate support ring, comprising:

an inner ring;

an outer ring that connects to an outer perimeter of the inner ring through a flat portion;

an edge lip that extends radially from an inner perimeter of the inner ring to form a supporting ledge; and

a substrate support that extends upwardly from a top surface of the supporting ledge, wherein the substrate support is a continuous ring-shaped body disposed around a circumference of the supporting ledge, wherein the substrate support comprises silicon carbide and the substrate support is coated with a layer of silicon dioxide, and the substrate support comprises a substrate contact surface having a radial width of about 5 μm to about 200 μm.

6. The substrate support ring of claim 5 , wherein the flat portion extends radially from an inner perimeter of the outer ring to the outer perimeter of the inner ring.

7. The substrate support ring of claim 6 , wherein the inner ring has a height of about 0 mm to about 3 mm.

8. The substrate support ring of claim 5 , wherein the substrate contact surface has a shape selected from the group consisting of hemispherical, rhombus, and triangular.

9. The substrate support ring of claim 8 , wherein the substrate contact surface has a hemispherical shape.

10. The substrate support ring of claim 5 , wherein the substrate support has a height of about 0.5 mm to about 3 mm.

11. The substrate support ring of claim 5 , wherein the radial width is about 50 μm.

12. A substrate support ring, comprising:

an inner ring;

an outer ring that connects to an outer perimeter of the inner ring through a flat portion;

an edge lip that extends radially from an inner perimeter of the inner ring to form a supporting ledge; and

a substrate support that extends upwardly from a top surface of the supporting ledge, wherein the substrate support is a continuous ring-shaped body disposed around a circumference of the supporting ledge, wherein the substrate support comprises silicon carbide and the substrate support is coated with a layer of polycrystalline silicon, and wherein the substrate support provides a substrate contact surface having a radial width of about 5 μm to about 200 μm.

13. The substrate support ring of claim 12 , wherein the edge lip has a width of between about 15 mm to about 40 mm.

14. The substrate support ring of claim 13 , wherein the edge lip extends radially beneath a substrate to be supported by the substrate support of about 0.5 mm to about 5.0 mm measured from an edge of the edge lip.

15. The substrate support ring of claim 14 , wherein the substrate support has a height of about 0.5 mm to about 3 mm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2013
From: PAN, HENG; TALLAVARJULA, SAIRAJU; BAUTISTA, KEVIN J.; TOBIN, JEFFREY
To: APPLIED MATERIALS, INC.
Reel/Frame 031598/0630 →
Continuity (2)
Provisional Application 61718090 · Oct 24, 2012
Related Publication 20140113458A1 · Apr 24, 2014