Radiation image detecting device and process for producing the same
The present invention provides a radiation image detecting device which suppresses occurrence of image irregularities and reduction of sharpness by joining a planar light-receiving device and a scintillator panel so that the distance between the planar light-receiving device and the scintillator panel via an adhesive layer is uniform in plane. The present invention also provides a process for producing the radiation image detecting device. The radiation image detecting device includes, in order, a scintillator panel including a support and a scintillator layer on the support, the scintillator layer having a film-thickness distribution; an adhesive layer; and a planar light-receiving device. In the radiation image detecting device, at least one of the support and the planar light-receiving device bends, so that the scintillator panel and the planar light-receiving device are arranged in plane via the adhesive layer at uniform distance.
1. A radiation image detecting device comprising, in order:
a scintillator panel comprising a support and a scintillator layer on the support, the scintillator layer having a film-thickness distribution;
an adhesive layer; and
a planar light-receiving device,
wherein at least one of the support and the planar light-receiving device bends, so that the scintillator panel and the planar light-receiving device are arranged in plane via the adhesive layer at uniform distance.
2. The radiation image detecting device according to claim 1 ,
wherein, when the elastic modulus of the support is defined as E1 (GPa) and a film-thickness of the support is defined as d1 (mm), an angle of maximum slope θ of a surface of the scintillator layer to a plane direction of the scintillator layer satisfies a relation expressed by the following expression (1):
tan θ× E 1× d 1≦0.1 (1) or
wherein, when the elastic modulus of the planar light-receiving device is defined as E2 (GPa) and a film-thickness of the planar light-receiving device is defined as d2 (mm), an angle of maximum slope θ of a surface of the scintillator layer to a plane direction of the scintillator layer satisfies a relation expressed by the following expression (2):
tan θ× E 2× d 2≦0.1 (2).
3. The radiation image detecting device according to claim 1 , wherein the film-thickness of the adhesive layer ranges from 1 μm to 30 μm.
4. The radiation image detecting device according to claim 1 , wherein the adhesive layer is a layer containing one type or two or more types of hot-melt resins.
5. The radiation image detecting device according to claim 4 , wherein the adhesive layer is a laminated body of two or more types of layers, and wherein the two or more types of layers are formed of hot-melt resins differing in melting point from one another.
6. The radiation image detecting device according to claim 5 , wherein, in the laminated body, a melting point of the hot-melt resin forming a layer touching the scintillator layer is higher than a melting point of the hot-melt resin forming a layer touching the planar light-receiving device.
7. The radiation image detecting device according to claim 4 , wherein the adhesive layer contains, in addition to the one type or two or more types of hot-melt resins, a spacer particle having a particle diameter comparable to the film-thickness of the adhesive layer and having a refractive index comparable to that of the hot-melt resins.
8. The radiation image detecting device according to claim 1 , wherein the scintillator layer is formed by vapor-deposition.
9. The radiation image detecting device according to claim 8 , wherein the scintillator layer is formed by vapor-depositing a phosphor material including cesium iodide and at least one type of an activator agent.
10. The radiation image detecting device according to claim 1 , wherein the support is configured by a glass plate or a resin film.
11. The radiation image detecting device according to claim 10 , wherein the support is configured by a resin film.
12. The radiation image detecting device according to claim 1 , wherein a substrate configuring the planar light-receiving device is configured by a glass plate or a resin film.
13. The radiation image detecting device according to claim 12 , wherein a substrate configuring the planar light-receiving device is configured by a resin film.
14. A process for producing a radiation image detecting device,
wherein the radiation image detecting device comprises, in order,
a scintillator panel comprising a support, and a scintillator layer on the support, the scintillator layer having a film-thickness distribution;
an adhesive layer; and
a planar light-receiving device, and
wherein the process comprises a step of joining the scintillator panel to the planar light-receiving device under heat from 50° C. to 150° C. so that the distance between the scintillator panel and the planar light-receiving device via the adhesive layer is uniform in plane.
15. The process according to claim 14 , wherein the adhesive layer is a layer containing one type or two or more types of hot-melt resins, and wherein melt-viscosities of the hot-melt resins range from 100 Pa·s to 100,000 Pa·s.
16. The process according to claim 14 , wherein the joining of the scintillator panel to the planar light-receiving device is performed, in addition to under heat from 50° C. to 150° C., under pressure of 10,000 Pa to 1,000,000 Pa.