Memory element with ion conductor layer in which metal ions diffuse and memory device incorporating same

1. A memory element comprising:

a first electrode;

a second electrode; and

a memory layer between the first and second electrodes,

wherein,

(a) the memory layer comprises (1) an ion source layer containing at least one of chalcogen element of tellurium (Te), sulfur (S), or selenium (Se) and at least one metal element selected from the group consisting of copper (Cu), silver (Ag), zinc (Zn), and zirconium (Zr), and (2) two or more high-resistance layers (a) having a resistance value higher than that of the ion source layer, (b) having different compositions with respect to each other and (c) that become relatively conductive upon application of a first voltage across the first and second electrodes and that become relatively non-conductive upon application of a second voltage across the first and second electrodes, the second voltage having a polarity which the reverse of that of the first voltage, and

(b) the two or more high-resistance layers include first and second high resistance layers with (i) the first high-resistance layer between the first electrode and the second high resistance layer and in contact with a surface of the first electrode, and (ii) the second high-resistance layer between the first high-resistance layer and the ion source layer.

2. The memory element according to claim 1 , wherein each of the two or more high-resistance layers is made of an oxide or nitride containing at least (a) a rare-earth element from a group consisting of yttrium (Y), lanthanum (La), neodymium (Nd), samarium (Sm), gadolinium (Gd), terbium (Tb), and dysprosium (Dy) or (b) an oxide or nitride containing at least one element selected from the group consisting of silicon (Si), aluminum (Al), titanium (Ti), and hafnium (Hf).

3. The memory element according to claim 1 , wherein the first high-resistance layer is made of gadolinium oxide (Gd—O), and the second high-resistance layer is made of a nitride or oxide of aluminum (Al) or silicon (Si).

4. The memory element according to claim 1 , wherein a resistance value is changed when a conduction path containing the metal element is formed in the memory layer by application of the first voltage to the first and second electrodes.

5. The memory element according to claim 1 , wherein the ion source layer contains aluminum (Al).

6. The memory device according to claim 1 , wherein the first high resistance layer is in contact with the entire surface of the first electrode.

7. A memory device comprising:

a plurality of memory elements each having a first electrode, a second electrode and a memory layer between the first and second electrodes; and

a pulse application section that selectively applies a voltage or current to the plurality of memory elements,

wherein,

(a) each memory layer comprises (1) an ion source layer containing at least one chalcogen element of tellurium (Te), sulfur (S), or selenium (Se) and at least one metal element selected from the group consisting of copper (Cu), silver (Ag), zinc (Zn), and zirconium (Zr); and (2) two or more high-resistance layers (a) having a resistance value higher than that of the ion source layer, (b) having different compositions with respect to each other, and (c) that become relatively conductive upon application of a first voltage across the first and second electrodes and that become relatively non-conductive upon application of a second voltage across the first and second electrodes, the second voltage having a polarity which the reverse of that of the first voltage,

(b) for each memory element, the two or more high-resistance layers include first and second high resistance layers with (i) the first high-resistance layer between the first electrode and the second high resistance layer and in contact with a surface of the first electrode, and (ii) the second high-resistance layer between the first high-resistance layer and the ion source layer.

8. The memory device according to claim 7 , wherein at least one of the layers of the memory layer is common to all of the memory elements.

9. The memory device according to claim 8 , wherein the two or more high-resistance layers are common to all of the memory elements and each memory element has a unique first electrode, second electrode and ion source layer.

10. The memory device according to claim 7 , wherein, for each memory element, each of the two or more high-resistance layers is made of an oxide or nitride containing at least (a) a rare-earth element from a group consisting of yttrium (Y), lanthanum (La), neodymium (Nd), samarium (Sm), gadolinium (Gd), terbium (Tb), and dysprosium (Dy) or (b) an oxide or nitride containing at least one element selected from the group consisting of silicon (Si), aluminum (Al), titanium (Ti), and hafnium (Hf).

11. The memory device according to claim 7 , wherein, for each memory element, the first high-resistance layer is made of gadolinium oxide (Gd-O), and the second high-resistance layer is made of a nitride or oxide of aluminum (Al) or silicon (Si).

12. The memory device according to claim 7 , wherein, for each memory element, a resistance value is changed when a conduction path containing the metal element is formed in the memory layer by application of the first voltage to the first and second electrodes.

13. The memory device according to claim 7 , wherein, for each memory element, the ion source layer contains aluminum (Al).

14. The memory device according to claim 7 , wherein the first high resistance layer is in contact with the entire surface of the first electrode.