Attenuation reduction structure for high frequency signal connection pads of circuit board with insertion component
Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.
1. An attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component, wherein:
the circuit board comprises a substrate, the substrate comprising a lower surface, an upper surface, a first end, a second end, and an extension section connected between the first end and the second end, the extension section extending in an extension direction;
at least one pair of lower connection pads are formed on a lower surface of the substrate to be adjacent to and spaced from each other;
at least one pair of upper connection pads are formed in a via arrangement zone defined in an upper surface to the substrate to be adjacent to and spaced from each other and respectively corresponding to the lower connection pads;
at least one pair of differential mode signal lines are formed on the extension section of the substrate to be adjacent to and spaced from each other and respectively connected to the adjacent upper connection pads, the at least one pair of differential mode signal lines transmitting at least one high-frequency differential mode signal, a site where the differential mode signal lines and the upper connection pads are connected to each other being defined as a transition zone;
a plurality of vias is arranged in the via arrangement zone, the vias respectively extending through and connected to the upper connection pads and the lower connection pads; and
the insertion component comprises a component body and a plurality of insertion pins extending from the component body;
characterized in that:
the lower surface of the substrate comprises a first metal layer formed thereon, the first metal layer comprising an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone, the attenuation reduction grounding pattern structure comprising:
a hollow area, which corresponds to the via arrangement zone, the hollow area covering the transition zone; and
at least one pair of protruded portions, which extends from the first metal layer in a direction toward the lower connection pads so as to extend a predetermined length to the transition zone and respectively correspond to the differential mode signal lines.
2. The attenuation reduction structure as claimed in claim 1 , wherein the insertion pins of the insertion component are respectively inserted from the upper surface of the substrate through the vias to project beyond the lower surface and soldered and fixed in position to the lower connection pads by solder.
3. The attenuation reduction structure as claimed in claim 1 , wherein the insertion pins of the insertion component are respectively inserted from the lower surface of the substrate through the vias to project beyond the upper surface and soldered and fixed in position to the upper connection pads by solder.
4. The attenuation reduction structure as claimed in claim 1 , wherein the protruded portions each comprise a gradually reducing width such that the protruded portions have a large width at connection thereof with the first metal layer and the width is gradually reduced in the extension direction toward the lower connection pads.
5. The attenuation reduction structure as claimed in claim 1 , wherein the upper surface of the substrate further comprises a second metal layer serving as one of a shielding layer, an impedance control layer, and a reference potential layer of the flexible circuit board.
6. The attenuation reduction structure as claimed in claim 1 , wherein the upper connection pads are each of a nonsymmetrical contour structure, where with a center of each of the vias being taken as a reference point, the upper connection pads each have a narrow face-to-face connection pad width between the two adjacent upper connection pads and a wide opposite connection pad width that is distant from the center reference point.
7. The attenuation reduction structure as claimed in claim 1 , wherein the lower connection pads are each of a nonsymmetrical contour structure, where with a center of each of the vias being taken as a reference point, the lower connection pads each have a narrow face-to-face connection pad width between the two adjacent lower connection pads and a wide opposite connection pad width that is distant from the center reference point.