IP Library Granted Patent US 9,577,620
Granted Patent B2
US 9,577,620 · App. 14/329,913 · Granted Feb 21, 2017

Printed circuit arrangement and method of forming the same

Inventors: Kok Leong Chang (Singapore, SG); Jie Zhang (Singapore, SG); Weng Yew Lee (Singapore, SG)
Assignee: Agency for Science, Technology and Research
H03K5/05H05K1/0248H05K1/0393H05K1/095H05K1/16Y10T29/49126
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Quick Facts
Patent No.
US 9,577,620
App. No.
14/329,913
Granted
Feb 21, 2017
Kind
B2
Abstract

In various embodiments, a printed circuit arrangement may be provided. The printed circuit arrangement may include a processor circuit. The printed circuit arrangement may further include a printed main circuit arrangement in electrical connection with a first input node of the processor circuit. The printed main circuit arrangement may be configured to receive at least one input signal and generate a main circuit signal based on the at least one input signal after a first delay from receiving the at least one input signal. The printed circuit arrangement may further include a printed reference circuit arrangement in electrical connection with a second input node of the processor circuit. The printed reference circuit arrangement may be configured to receive a further input signal, may have a second delay and may be configured such that the second delay adapts to the first delay.

Claims (52)

1. A printed circuit arrangement comprising:

a processor circuit having a first input node, a second input node and an output node;

a printed main circuit arrangement in electrical connection with the first input node of the processor circuit, the printed main circuit arrangement configured to receive at least one input signal and generate a main circuit signal based on the at least one input signal after a first delay from receiving the at least one input signal; and

a printed reference circuit arrangement in electrical connection with the second input node of the processor circuit, the printed reference circuit arrangement configured to receive a further input signal, wherein the printed reference circuit arrangement has a second delay and is configured such that the second delay adapts to the first delay and is configured to generate a reference circuit signal based on the further input signal after the second delay from receiving the further input signal;

wherein the processor circuit is configured to generate an output signal at the output node based on the main circuit signal in response to the reference circuit signal.

2. The printed circuit arrangement according to claim 1 ,

wherein the second delay is within a predetermined range of the first delay.

3. The printed circuit arrangement according to claim 1 ,

wherein the printed reference circuit arrangement comprises a match delay circuit arrangement, the match delay circuit arrangement configured to receive the further input signal.

4. The printed circuit arrangement according to claim 3 ,

wherein the printed reference circuit arrangement further comprises a Muller-C element.

5. The printed circuit arrangement according to claim 4 ,

wherein the Muller-C element has a first input, a second input and an output;

wherein the first input of the Muller-C element is coupled to the match delay circuit; and

wherein the output of the Muller-C element is coupled to the processor circuit.

6. The printed circuit arrangement according to claim 5 ,

wherein the second input of the Muller-C element is configured to receive an additional input signal.

7. The printed circuit arrangement according to claim 1 ,

wherein the main circuit arrangement is an adder circuit.

8. The printed circuit arrangement according to according to claim 1 ,

wherein the printed main circuit arrangement comprises a logic circuit; and

wherein the printed reference circuit arrangement comprises a further logic circuit complementary to the logic circuit.

9. The printed circuit arrangement according to claim 1 ,

wherein the processor circuit comprises a memory circuit.

10. The printed circuit arrangement according to claim 1 ,

wherein the printed reference circuit arrangement has a rate of degradation substantially equal to a rate of degradation of the printed main circuit arrangement.

11. The printed circuit arrangement according to claim 1 ,

wherein the processor circuit is configured to generate the output signal at the output node upon receiving the reference circuit signal.

12. The printed circuit arrangement according to claim 1 ,

wherein the printed main circuit arrangement comprises conductive ink printed on a substrate; and

wherein the printed reference circuit arrangement comprises conductive ink printed on the substrate.

13. The printed arrangement according to claim 12 ,

wherein the substrate is a flexible substrate.

14. The printed circuit arrangement according to claim 1 ,

wherein the processor circuit is a printed circuit arrangement.

15. The printed circuit arrangement according to claim 1 ,

wherein the printed main circuit arrangement comprises at least one printed electrical component; and

wherein the printed reference circuit arrangement comprises at least one printed electrical component.

16. The printed circuit arrangement according to claim 1 ,

wherein the printed reference circuit arrangement is within a predetermined distance from the printed main circuit arrangement.

17. A method of forming a printed circuit arrangement, the method comprising:

providing a processor circuit having a first input node, a second input node and an output node;

electrically connecting a printed main circuit arrangement with the first input node of the processor circuit, the printed main circuit arrangement configured to receive at least one input signal and generate a main circuit signal based on the at least one input signal after a first delay from receiving the at least one input signal; and

electrically connecting a printed reference circuit arrangement with the second input node of the processor circuit, the printed reference circuit arrangement configured to receive a further input signal, wherein the printed reference circuit arrangement has a second delay and is configured such that the second delay adapts to the first delay and is configured to generate a reference circuit signal based on the further input signal after the second delay from receiving the further input signal;

wherein the processor circuit is configured to generate an output signal at the output node based on the main circuit signal in response to the reference circuit signal.

18. The method according to claim 17 , the method further comprising:

printing at least one electrical component of the printed main circuit on a substrate using conductive ink; and

printing at least one electrical component of the printed reference circuit arrangement on the substrate within the predetermined range from the printed main circuit using conductive ink.

19. The method according to claim 17 ,

wherein electrically connecting the printed main circuit arrangement with the first input node of the processor circuit comprises using conductive ink to electrically connect the printed main circuit arrangement with the first input node of the processor circuit.

20. The method according to claim 17 ,

wherein electrically connecting the printed reference circuit arrangement with the second input node of the processor circuit comprises using conductive ink to electrically connect the printed reference circuit arrangement with the second input node of the processor circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2014
From: CHANG, KOK LEONG; ZHANG, JIE; LEE, WENG YEW
To: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Reel/Frame 033914/0264 →
Priority Claims (1)
SG 201305367 · Jul 12, 2013 · national
Continuity (1)
Related Publication 20150016048A1 · Jan 15, 2015