Methods and devices for sample lysis
Disclosed herein are methods and systems for use in preparing a sample. The methods and systems may be used for lysing one or more structures in a sample (e.g., cells, viral particles, etc.). The methods and compositions may comprise a microfluidic chip or use thereof. The microfluidic chips disclosed herein may comprise (a) a substrate comprising a chamber, wherein at least one mechanical element may be located within the chamber; (b) a thermal element in contact with the chamber; and (c) at least one aperture within the surface of the substrate, wherein the aperture may be configured to insulate the chamber.
1. A microfluidic chip comprising:
a. a chamber which comprises at least one stir bar or a plurality of granular particles;
b. a thermal device in thermal contact with the chamber; and
c. at least one insulative groove within the surface of the chip, wherein the at least one insulative groove is configured such that during operation of the chip, ambient air enters the at least one insulative groove and insulates the chamber, and wherein the at least one insulative groove is a plurality of grooves positioned around the chamber.
2. The microfluidic chip of claim 1 , wherein the thermal device is a heater or a cooler.
3. The microfluidic chip of claim 1 , wherein the at least one insulative groove is nine insulative grooves.
4. The microfluidic chip of claim 1 , wherein the stir bar is composed of magnetic material.
5. The microfluidic chip of claim 1 , wherein the microfluidic chip is coupled to an external magnetic field.
6. The microfluidic chip of claim 1 , wherein the granular particles are beads.
7. The microfluidic chip of claim 6 , wherein the beads are magnetic or made of glass or cubic-zirconium.
8. The microfluidic chip of claim 1 , further comprising a vent, a filter, a pouch or one or more additional chambers.
9. The microfluidic chip of claim 1 , further comprising a thermal conductor, a thermal transducer or a thermal sensor.
10. The microfluidic chip of claim 8 , wherein the pouch is made of polypropylene, polyethylene, polyethylene terephthalate (PET) or combinations thereof.
11. The microfluidic chip of claim 1 , wherein the microfluidic chip is manufactured by using converted-tape technology.
12. The microfluidic chip of claim 1 , wherein the chamber comprises at least one stir bar.
13. The microfluidic chip of claim 1 , wherein the thermal device is in mechanical contact with the chamber.
14. The microfluidic chip of claim 1 , further comprising a thermal transducer in thermal contact with the chamber.
15. The microfluidic chip of claim 1 , wherein the thermal device is a heater.
16. The microfluidic chip of claim 1 , wherein the thermal device is a resistive heater.
17. The microfluidic chip of claim 15 , wherein the heater is attached to the chamber via an adhesive.
18. The microfluidic chip of claim 17 , wherein the adhesive is heat conductive.
19. The microfluidic chip of claim 17 , wherein the adhesive is pressure sensitive.
20. The microfluidic chip of claim 1 , wherein the chamber comprises two chambers.
21. The microfluidic chip of claim 1 , wherein a cross-section of the at least one insulative groove is not circular.
22. The microfluidic chip of claim 1 , wherein the at least one insulative groove is less than 100 μm in length.
23. The microfluidic chip of claim 1 , wherein the at least one insulative groove is less than 30 μm in width.
24. The microfluidic chip of claim 1 , wherein the at least one insulative groove is greater than 0.001 μm in length.