Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
A carrier apparatus positions a chuck member above a wafer mounted on a fine movement stage, relatively moves the chuck member and the fine movement stage in a vertical direction, makes the chuck member approach a position which is a predetermined distance away from the upper surface of the wafer, makes the chuck member hold the wafer from above in a non-contact manner, and makes the chuck member holding the wafer and the fine movement stage move apart within a predetermined plane after making the chuck member holding the wafer and the fine movement stage move apart in the vertical direction. Further, the carrier apparatus loads the wafer held in a non-contact manner from above by the chuck member on the fine movement stage.
1. An object loading method comprising:
positioning an object under a loading member;
holding the object by the loading member, the loading member holding the object from above in a non-contact manner;
relatively moving the object held by the loading member and a stage having a holder so that the object is located above the holder; and
loading the object that is held by the loading member onto the stage, by moving the loading member downward to a predetermined position in which a lower surface of the object comes into contact with the holder.
2. The loading method according to claim 1 , wherein
the object is carried to a space under the loading member by a carrier member.
3. The loading method according to claim 1 , wherein
the stage moves to a space under the loading member so that the object held by the loading member is positioned above the stage.
4. The loading method according to claim 1 , wherein
the loading member which holds the object moves toward the stage.
5. The loading method according to claim 1 , wherein
a position of the object is detected by a position sensor attached to the loading member when the object is held by the loading member.
6. The loading method according to claim 5 , wherein
the position sensor includes an imaging device.
7. The loading method according to claim 1 , wherein
a gap between the object and the loading member is detected by a gap sensor attached to the loading member when the object is held by the loading member.
8. The loading method according to claim 7 , wherein
the gap sensor includes a capacitive sensor.
9. An exposure method which exposes an object, the method comprising:
loading an object onto a stage by using the loading method according to claim 1 ; and
exposing the object on the stage.
10. The loading method according to claim 1 , wherein
the predetermined position is a position in which an upper surface of the stage and an upper surface of the object loaded on the stage are substantially flush.
11. An exposure apparatus which exposes an object via a projection optical system, the apparatus comprising:
a stage having a holder, that moves under the projection optical system;
a loading member which holds the object from above in a non-contact manner; and
a controller which relatively moves the object held by the loading member and the stage so that the object is located above the holder, and loads the object that is held by the loading member onto the stage by moving loading member downward to a predetermined position in which a lower surface of the object comes into contact with the holder.
12. The exposure apparatus according to claim 11 , further comprising:
a carrier member which carries the object to a space under the loading member.
13. The exposure apparatus according to claim 11 , wherein
the stage is configured to move to a space under the loading member so that the object held by the loading member is positioned above the stage.
14. The exposure apparatus according to claim 11 , wherein
the loading member which holds the object is configured to move toward the stage.
15. The exposure apparatus according to claim 11 , further comprising:
a position sensor which detects a position of the object when the object is held by the loading member.
16. The exposure apparatus according to claim 15 , wherein
the position sensor is attached to the loading member.
17. The exposure apparatus according to claim 11 , further comprising:
a gap sensor which detects a gap between the object and the loading member when the object is held by the loading member.
18. The exposure apparatus according to claim 17 , wherein
the gap sensor is attached to the loading member.
19. The exposure apparatus according to claim 11 , wherein
the predetermined position is a position in which an upper surface of the stage and an upper surface of the object loaded on the stage are substantially flush.