IP Library Granted Patent US 9,593,170
Granted Patent B2
US 9,593,170 · App. 14/889,793 · Granted Mar 14, 2017

Compound, photocurable composition, and methods for producing patterned film, optical component, circuit board, electronic component by using the photocurable composition, and cured product

Inventors: Toshiki Ito (Kawasaki, JP); Takeshi Honma (Tokyo, JP); Shiori Yonezawa (Tokyo, JP); Hitoshi Sato (Utsunomiya, JP); Youji Kawasaki (Utsunomiya, JP)
Assignee: Canon Kabushiki Kaisha
C08F2/50C07C217/08C07C217/40G02B1/12G03F7/0002H01L21/02118H01L21/3081H01L21/311H05K3/0076H05K3/0079H05K3/0082H05K3/30H05K2203/0548
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Quick Facts
Patent No.
US 9,593,170
App. No.
14/889,793
Granted
Mar 14, 2017
Kind
B2
Abstract

A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided. A compound is represented by general formula (1): where R f represents an alkyl group at least part of which is substituted with fluorine, R O represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, R A represents an alkyl group, and R B represents an alkyl group or a hydrogen atom.

Claims (44)

1. A photocurable composition comprising:

a component (A) which is a polymerizable compound;

a component (B) which is a photopolymerization initiator; and

a component (C) which is a compound represented by general formula (1):

where R f represents an alkyl group at least part of which is substituted with fluorine, R O represents a repeated structure of an oxyalkylene group or an oxypropylene group, N represents a nitrogen atom, R A represents an alkyl group, and R B represents an alkyl group or a hydrogen atom.

2. A photocurable composition comprising:

a component (A) which is a polymerizable compound;

a component (B) which is a photopolymerization initiator; and

a component (C) which is a compound represented by general formula (1):

where R f represents an alkyl group at least part of which is substituted with fluorine, R O represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, R A represents an alkyl group, and R B represents an alkyl group or a hydrogen atom.

3. The photocurable composition according to claim 2 , wherein R B represents an alkyl group.

4. The photocurable composition according to claim 3 , wherein R A and R B each represent a linear alkyl group having 1 to 5 carbon atoms.

5. The photocurable composition according to claim 2 , wherein the compound represented by general formula (1) is a compound represented by general formula (5):

where a represents an integer in a range of 1 to 25, b represents an integer in a range of 0 to 25, c represents an integer in a range of 1 to 25, R 1 represents an alkyl group, and R 2 represents an alkyl group or hydrogen.

6. The photocurable composition according to claim 5 , wherein a, b, and c in general formula (5) each independently represent an integer in a range of 1 to 10.

7. The photocurable composition according to claim 5 , wherein b in general formula (5) represents an integer in a range of 1 to 5.

8. The photocurable composition according to claim 5 , wherein R 2 in general formula (5) represents an alkyl group.

9. The photocurable composition according to claim 8 , wherein R 1 and R 2 in general formula (5) each represent a linear alkyl group having 1 to 5 carbon atoms.

10. A method for producing a patterned film, the method comprising:

a placement step of placing the photocurable composition according to claim 2 on a substrate;

a mold contact step of bringing the photocurable composition into contact with a mold having an original pattern for transferring a pattern shape;

an irradiation step of irradiating the photocurable composition with light to form a cured film; and

a mold releasing step of releasing the cured film from the mold.

11. The method according to claim 10 , wherein a surface of the original pattern of the mold has hydroxyl groups.

12. The method according to claim 11 , wherein the surface of the original pattern of the mold is composed of quartz.

13. The method according to claim 10 , wherein the mold contact step is performed in an atmosphere composed of a gas containing a condensable gas.

14. The method according to claim 13 , wherein the gas containing the condensable gas is a gas mixture containing helium and the condensable gas.

15. The method according to claim 13 , wherein the condensable gas is 1,1,1,3,3-pentafluoropropane.

16. A method for producing an optical component, the method comprising:

a step of obtaining a patterned film on a substrate by the method according to claim 10 .

17. A method for producing an optical component, the method comprising:

a step of obtaining a patterned film by the method according to claim 10 ; and

a step of etching or ion-implanting the substrate by using a pattern shape of the obtained patterned film as a mask.

18. A method for producing a circuit board, the method comprising:

a step of obtaining a patterned film by the method according claim 10 ;

a step of etching or ion-implanting the substrate by using a pattern shape of the obtained patterned film as a mask; and

a step of forming an electronic part on the substrate.

19. A method for forming an electronic component, the method comprising:

a step of obtaining a circuit board by the method according to claim 18 ; and

a step of connecting the circuit board to a controlling mechanism for controlling the circuit board.

20. A cured product obtained by curing the photocurable composition according to claim 2 .

21. The photocurable composition according to claim 2 , wherein a blend ratio of the component (C) is 0.001% by weight or more and 10% by weight or less relative to a total weight of the polymerizable compound serving as the component (A).

22. The photocurable composition according to claim 2 , further comprising a hydrogen donor, wherein the ratio of the hydrogen donor is 0% or more and 20% by weight or less relative to a total weight of the polymerizable compound serving as the component (A).

23. The photocurable composition according to claim 2 , wherein a viscosity of the photocurable composition is 5 cP or more and 50 cP or less in terms of a viscosity of a mixture of the components other than a solvent at 23° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2015
From: ITO, TOSHIKI; HONMA, TAKESHI; YONEZAWA, SHIORI; SATO, HITOSHI; KAWASAKI, YOUJI
To: CANON KABUSHIKI KAISHA
Reel/Frame 037362/0121 →
Priority Claims (1)
JP 2013-099551 · May 9, 2013 · national
Continuity (1)
Related Publication 20160108142A1 · Apr 21, 2016