Nonvolatile semiconductor memory device and method of manufacturing the same
The memory cell array includes a memory string and a select transistor. The memory string includes plural memory cells connected in series, the memory string being formed to extend in a first direction as a lengthwise direction. The select transistor is connected to one end of the memory string. In the wiring section, a conductive layer and an interlayer insulating layer are laminated alternately to form plural layers. The conductive layer functions as a gate electrode of the memory cells and the select transistor. One select transistor includes plural conductive layers, and the plural conductive layers are connected in common by a common first contact. The plurality of the conductive layers and the first contact include a barrier metal formed in a periphery thereof. The plurality of the conductive layers and the first contact are in contact without the barrier metal therebetween at a boundary thereof.
1. A nonvolatile semiconductor memory device, comprising:
a memory cell array including a memory string and a select transistor, the memory string including a plurality of memory cells connected in series, the memory string being formed to extend in a first direction, and the select transistor being connected to one end of the memory string; and
a wiring section in which a conductive layer and an interlayer insulating layer are laminated alternately to form plural layers,
one select transistor including a plurality of conductive layers, and the plurality of the conductive layers being connected in common by a common first contact,
the plurality of the conductive layers and the first contact including a barrier metal formed in a periphery thereof, and
the plurality of the conductive layers and the first contact being in contact without the barrier metal therebetween at a boundary thereof.
2. The nonvolatile semiconductor memory device according to claim 1 , further comprising a second contact electrically connected to one of the plurality of the conductive layers.
3. The nonvolatile semiconductor memory device according to claim 1 , further comprising a third contact having a lower end electrically connected to an upper end of the first contact.
4. The nonvolatile semiconductor memory device according to claim 1 , wherein the plurality of the conductive layers included in the one select transistor have ends aligned in their lengthwise direction.
5. The nonvolatile semiconductor memory device according to claim 4 , further comprising a second contact electrically connected to one of the plurality of the conductive layers.
6. The nonvolatile semiconductor memory device according to claim 4 , further comprising a third contact having a lower end electrically connected to an upper end of the first contact.
7. The nonvolatile semiconductor memory device according to claim 1 , wherein
the select transistor includes a first select transistor that controls a connection between a bit line and the memory string, and a second select transistor that controls a connection between a source line and the memory string.
8. The nonvolatile semiconductor memory device according to claim 7 , wherein
wherein the plurality of the conductive layers included in the one select transistor have ends aligned in their lengthwise direction.
9. The nonvolatile semiconductor memory device according to claim 1 , further comprising a support member formed to penetrate the plurality of the conductive layers.
10. The nonvolatile semiconductor memory device according to claim 9 , further comprising a plurality of support members, wherein the first contact is located between the plurality of the support members.
11. The nonvolatile semiconductor memory device according to claim 9 , further comprising a second contact electrically connected to one of the plurality of the conductive layers, and a plurality of support members,
wherein the plurality of the support members are included therein, and the first contact is located between the plurality of the support members.
12. The nonvolatile semiconductor memory device according to claim 1 , wherein the conductive layers comprise a metal film.