IGBT and IGBT manufacturing method
An IGBT manufacturing method is provided. The IGBT has an n-type emitter region, a p-type top body region, an n-type intermediate region, a p-type bottom body region, an n-type drift region, a p-type collector region, trenches penetrating the emitter region, the top body region, the intermediate region and the bottom body region from an upper surface of a semiconductor substrate and reaching the drift region, and gate electrodes formed in the trenches. The method includes forming the trenches on the upper surface of the semiconductor substrate, forming the insulating film in the trenches, forming an electrode layer on the semiconductor substrate and in the trenches after forming the insulating film, planarizing an upper surface of the electrode layer, and implanting n-type impurities to a depth of the intermediate region from the upper surface side of the semiconductor substrate after planarizing the upper surface of the electrode layer.
1. A method for manufacturing an IGBT,
the IGBT comprising:
an n-type emitter region;
a p-type top body region formed under the emitter region;
an n-type intermediate region formed under the top body region;
a p-type bottom body region formed under the intermediate region;
an n-type drift region formed under the bottom body region;
a p-type collector region in contact with the drift region;
a plurality of trenches penetrating the emitter region, the top body region, the intermediate region and the bottom body region from an upper surface of a semiconductor substrate and reaching the drift region; and
gate electrodes formed in the trenches, each of which faces the top body region, the intermediate region and the bottom body region located between the emitter region and the drift region via an insulating film,
the method comprising:
forming the trenches on the upper surface of the semiconductor substrate;
forming the insulating film in the trenches;
forming an electrode layer on the semiconductor substrate and in the trenches after forming the insulating film;
planarizing an upper surface of the electrode layer so that a variation of depth of the upper surface is a difference between a depth of a deepest position of the upper surface and a depth of a shallowest position of the upper surface and the variation of depth is less than or equal to 110 nm; and
implanting n-type impurities through the planarized upper surface of the electrode layer, with the variation of depth being less than or equal to 110 nm, to a target region located at a depth of the intermediate region from a side of the upper surface of the semiconductor substrate after planarizing the upper surface of the electrode layer, wherein the target region continuously extends across portions of the electrode layer located in the trenches and portions of the semiconductor substrate located between the trenches.
2. The method according to claim 1 , further comprising removing a portion of the electrode layer that includes the planarized upper surface after implanting the n-type impurities.
3. The method according to claim 1 , wherein implanting the n-type impurities is performed in a state where a mask is not located on portions of the electrode layer above the trenches.
4. A method for manufacturing an IGBT,
the IGBT comprising:
an n-type emitter region;
a p-type top body region formed under the emitter region;
an n-type intermediate region formed under the top body region;
a p-type bottom body region formed under the intermediate region;
an n-type drift region formed under the bottom body region;
a p-type collector region in contact with the drift region;
a plurality of trenches penetrating the emitter region, the top body region, the intermediate region and the bottom body region from an upper surface of a semiconductor substrate and reaching the drift region; and
gate electrodes formed in the trenches, each of which faces the top body region, the intermediate region and the bottom body region located between the emitter region and the drift region via an insulating film,
the method comprising:
forming the trenches on the upper surface of the semiconductor substrate;
forming the insulating film in the trenches;
forming the gate electrodes in the trenches after forming the insulating film so that upper surfaces of the gate electrodes are located at positions lower than upper ends of the trenches;
forming a mask member on each gate electrode or forming a mask member on the semiconductor substrate so that the mask member is thicker on the gate electrodes than on other regions; and
implanting n-type impurities through the mask member to a target region located at a depth of the intermediate region from a side of the upper surface of the semiconductor substrate after forming the mask member, wherein the target region continuously extends across portions of the electrode layer located in the trenches and portions of the semiconductor substrate located between the trenches.
5. The method according to claim 4 , wherein the mask member is at least partly formed on the upper surfaces of the gate electrodes that are located at the positions lower than the upper ends of the trenches.
6. The method according to claim 4 , wherein the mask member is formed on the semiconductor substrate so that the mask member is thicker on the gate electrodes than on other regions.
7. A method for manufacturing an IGBT,
the IGBT comprising:
an n-type emitter region;
a p-type body region formed under the emitter region;
an n-type intermediate region formed under the body region;
an n-type drift region formed under the intermediate region, wherein an n-type impurity density in the drift region is lower than that in the intermediate region;
a p-type collector region formed under the drift region;
a plurality of trenches penetrating the emitter region, the body region and the intermediate region from an upper surface of a semiconductor substrate and reaching the drift region; and
gate electrodes formed in the trenches, each of which faces the body region located between the emitter region and the intermediate region via an insulating film,
the method comprising:
forming the trenches on the upper surface of the semiconductor substrate;
forming the insulating film in the trenches;
forming an electrode layer on the semiconductor substrate and in the trenches after forming the insulating film;
planarizing an upper surface of the electrode layer so that a variation of depth of the upper surface is a difference between a depth of a deepest position of the upper surface and a depth of a shallowest position of the upper surface and the variation of depth is less than or equal to 110 nm; and
implanting n-type impurities through the planarized upper surface of the electrode layer, with the variation of depth being less than or equal to 110 nm, to a target region located at a depth of the intermediate region from a side of the upper surface of the semiconductor substrate after planarizing the upper surface of the electrode layer, wherein the target region continuously extends across portions of the electrode layer located in the trenches and portions of the semiconductor substrate located between the trenches.
8. The method according to claim 7 , further comprising removing a portion of the electrode layer that is outside the trenches and includes the planarized upper surface after implanting the n-type impurities.
9. The method according to claim 7 , wherein implanting the n-type impurities is performed in a state where a mask is not located on portions of the electrode layer above the trenches.
10. A method for manufacturing an IGBT,
the IGBT comprising:
an n-type emitter region;
a p-type body region formed under the emitter region;
an n-type intermediate region formed under the body region;
an n-type drift region formed under the intermediate region, wherein an n-type impurity density in the drift region is lower than that in the intermediate region;
a p-type collector region formed under the drift region;
a plurality of trenches penetrating the emitter region, the body region and the intermediate region from an upper surface of a semiconductor substrate and reaching the drift region; and
gate electrodes formed in the trenches, each of which faces the body region located between the emitter region and the intermediate region via an insulating film,
the method comprising:
forming the trenches on the upper surface of the semiconductor substrate;
forming the insulating film in the trenches;
forming the gate electrodes in the trenches after forming the insulating film so that upper surfaces of the gate electrodes are located at positions lower than upper ends of the trenches;
forming a mask member on each gate electrode or forming a mask member on the semiconductor substrate so that the mask member is thicker on the gate electrodes than on other regions; and
implanting n-type impurities through the mask member to a target region located at a depth of the intermediate region from a side of the upper surface of the semiconductor substrate after forming the mask member, wherein the target region continuously extends across portions of the electrode layer located in the trenches and portions of the semiconductor substrate located between the trenches.
11. The method according to claim 10 , wherein the mask member is at least partly formed on the upper surfaces of the gate electrodes that are located at the positions lower than the upper ends of the trenches.
12. The method according to claim 10 , wherein the mask member is formed on the semiconductor substrate so that the mask member is thicker on the gate electrodes than on other regions.