Epoxy resin composition
The present technology is an epoxy resin composition containing an epoxy resin (A), a urethane resin (B) in which the terminal isocyanate of the urethane prepolymer is blocked by at least one of an ε-polycaprolactam, an oxime, or a pyrazole, and in which bisphenol A is included in the backbone of the aforementioned urethane prepolymer, and a curing agent (C).
1. An epoxy resin composition comprising:
an epoxy resin (A),
a urethane resin (B) comprising a urethane prepolymer formed by reacting one or more polyol compounds, one or more isocyanate compounds, and bisphenol A to form a urethane prepolymer having a terminal isocyanate, reacting the urethane prepolymer having the terminal isocyanate with at least one of an ε-polycaprolactam, an oxime, or a pyrazole to block the terminal isocyanate, and
a curing agent (C) selected from the group consisting of dicyandiamide, 4,4-diaminodiphenylsulfone, an imidazole derivative, isophthalic acid dihydrazide, an N,N-dialkylurea derivative, an N,N-dialkylthiourea derivative, an acid anhydride, isophorone diamine, m-phenylene diamine, N-aminoethylpiperazine, melamine, guanamine, a boron trifluoride complex, tris(dimethylaminomethyl)phenol, a polythiol, and combinations thereof,
wherein a ratio of a number of moles of hydroxy groups on the one or more polyol compounds that are reacted to a number of moles of hydroxy groups on the bisphenol A that are reacted ((polyol-OH)/(BisA-OH)) is from about 1:0.1 to about 1:3.0.
2. The epoxy resin composition according to claim 1 , wherein the urethane resin (B) is obtained by reacting one or more polyol compounds is selected from the group consisting of a poly(tetramethylene glycol) and a polycarbonate polyol and the one or more isocyanate compounds is selected from the group consisting of hexamethylene diisocyanate and isophorone diisocyanate.
3. The epoxy resin composition according to claim 2 , wherein a content of the urethane resin (B) is not less than 10 parts by mass and not more than 80 parts by mass per 100 parts by mass of the epoxy resin (A).
4. The epoxy resin composition according to claim 3 , comprising a rubber-modified epoxy resin (D).
5. The epoxy resin composition according to claim 2 , comprising a rubber-modified epoxy resin (D).
6. The epoxy resin composition according to claim 1 , wherein a content of the urethane resin (B) is not less than 10 parts by mass and not more than 80 parts by mass per 100 parts by mass of the epoxy resin (A).
7. The epoxy resin composition according to claim 1 , comprising a rubber-modified epoxy resin (D).
8. The epoxy resin composition according to claim 1 , wherein the curing agent (C) is selected from the group consisting of dicyandiamide, 4,4-diaminodiphenylsulfone, 2-n-heptadecylimidazole, isophthalic acid dihydrazide, an N,N-dialkylurea derivative, an acid anhydride, isophorone diamine, m-phenylene diamine, N-aminoethylpiperazine, melamine, guanamine, a boron trifluoride complex, tris(dimethylaminomethyl)phenol, and a polythiol.
9. The epoxy resin composition according to claim 1 , wherein the curing agent (C) is dicyandiamide.
10. An epoxy resin composition comprising:
an epoxy resin (A),
a urethane resin (B) comprising a urethane prepolymer formed by reacting one or more polyol compounds, one or more isocyanate compounds, and bisphenol A to form a urethane prepolymer having a terminal isocyanate, reacting the urethane prepolymer having the terminal isocyanate with at least one of an ε-polycaprolactam, an oxime, or a pyrazole to block the terminal isocyanate, and
a curing agent (C) selected from the group consisting of 4,4-diaminodiphenylsulfone, an imidazole derivative, isophthalic acid dihydrazide, an N,N-dialkylurea derivative, an N,N-dialkylthiourea derivative, an acid anhydride, isophorone diamine, m-phenylene diamine, N-aminoethylpiperazine, melamine, a boron trifluoride complex, tris(dimethylaminomethyl)phenol, a polythiol, and combinations thereof,
wherein a ratio of a number of moles of hydroxy groups on the one or more polyol compounds that are reacted to a number of moles of hydroxy groups on the bisphenol A that are reacted ((polyol-OH)/(BisA-OH)) is from about 1:0.1 to about 1:3.0.