Light emitting device reflective bank structure
Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
1. A light emitting diode bank structure comprising:
a substrate;
an insulating layer on the substrate;
an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls;
a corresponding array of vertical light emitting diode devices mounted within the array of bank openings, wherein each vertical light emitting device has a maximum width of 1 μm-100 μm and includes:
a micro p-n diode that includes a plurality of layers including a top p-doped or n-doped layer, a lower p-doped or n-doped layer, and one or more quantum well layers between the top and lower p-doped or n-doped layers, wherein one or more of the plurality of layers is based on II-VI materials or III-V materials;
a top conductive electrode; and
a bottom conductive electrode;
a passivation layer spanning sidewalls of the array of vertical light emitting diode devices and least partially filling the array of bank openings, wherein the passivation layer does not completely cover the top conductive electrode of each vertical light emitting diode device; and
a transparent conductor layer over and in electrical contact with the top conductive electrode for each vertical light emitting diode device.
2. The light emitting diode bank structure of claim 1 , wherein a top surface of each vertical light emitting diode device is above a top surface of the insulating layer.
3. The light emitting diode bank structure of claim 1 , wherein no vertical light emitting diode device spans along a sidewall of a corresponding bank opening.
4. The light emitting diode bank structure of claim 1 , wherein the passivation layer is transparent the visible wavelength spectrum.
5. The light emitting diode bank structure of claim 4 , further comprising a reflective layer spanning the sidewalls of each of the bank openings in the insulating layer.
6. The light emitting diode bank structure of claim 5 , wherein the reflective layer completely covers the sidewalls of each of the bank openings.
7. The light emitting diode bank structure of claim 5 , wherein the reflective layer completely covers the bottom surface of each of the bank openings.
8. The light emitting diode bank structure of claim 5 , wherein the passivation layer covers the reflecting layer that spans the sidewalls of each of the bank openings in the insulating layer.
9. A light emitting diode bank structure comprising:
a substrate;
an insulating layer on the substrate;
an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls;
a corresponding array of vertical light emitting diode devices mounted within the array of bank openings, wherein each vertical light emitting device has a maximum width of 1 μm-100 μm and includes:
a micro p-n diode that includes a plurality of layers including a top p-doped or n-doped layer, a lower p-doped or n-doped layer, and one or more quantum well layers between the top and lower p-doped or n-doped layers, wherein one or more of the plurality of layers is based on II-VI materials or III-V materials;
a top conductive electrode; and
a bottom conductive electrode;
a passivation layer spanning sidewalls of the array of vertical light emitting diode devices and least partially filling the array of bank openings; and
one or more integrated circuits interconnected with the bottom conductive electrodes of each vertical light emitting diode device; and
an electrical line out on the insulating layer and in electrical contact with the top conductive electrode of each vertical light emitting diode device.
10. The light emitting diode bank structure of claim 9 , further comprising a transparent conductor layer over and in electrical contact with the electrical line out and the top conductive electrode of each vertical light emitting diode device.
11. A light emitting diode bank structure comprising:
a substrate;
an insulating layer on the substrate;
an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls;
a corresponding array of vertical light emitting diode devices mounted within the array of bank openings, wherein each vertical light emitting device has a maximum width of 1 μm-100 μm and includes:
a micro p-n diode that includes a plurality of layers including a top p-doped or n-doped layer, a lower p-doped or n-doped layer, and one or more quantum well layers between the top and lower p-doped or n-doped layers, wherein one or more of the plurality of layers is based on II-VI materials or III-V materials;
a top conductive electrode; and
a bottom conductive electrode;
a passivation layer spanning sidewalls of the array of vertical light emitting diode devices and least partially filling the array of bank openings;
one or more integrated circuits interconnected with the bottom conductive electrodes of each vertical light emitting diode device;
a via opening in the insulating layer; and
an electrical line out beneath the via opening and in electrical contact with the top conductive electrode of each vertical light emitting diode device.
12. The light emitting diode bank structure of claim 11 , further comprising a transparent conductor layer over and in electrical contact with the electrical line out and the top conductive electrode of each vertical light emitting diode device.
13. A light emitting diode bank structure comprising:
a substrate;
an insulating layer on the substrate;
an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls;
a corresponding array of vertical light emitting diode devices mounted within the array of bank openings, wherein each vertical light emitting device has a maximum width of 1 μm-100 μm and includes:
a micro p-n diode that includes a plurality of layers including a top p-doped or n-doped layer, a lower p-doped or n-doped layer, and one or more quantum well layers between the top and lower p-doped or n-doped layers, wherein one or more of the plurality of layers is based on II-VI materials or III-V materials;
a top conductive electrode; and
a bottom conductive electrode;
a passivation layer spanning sidewalls of the array of vertical light emitting diode devices and least partially filling the array of bank openings;
one or more integrated circuits interconnected with the bottom conductive electrodes of each vertical light emitting diode device; and
an array of electrical lines out on the insulating layer, the array of electrical lines out in electrical contact with the top conductive electrodes of the array of vertical light emitting diode devices.
14. The light emitting diode bank structure of claim 13 , further comprising an array of transparent conductor layers, each transparent conductor layer over and in electrical contact with a corresponding electrical line out and a top conductive electrode of a corresponding vertical light emitting diode device.
15. A light emitting diode bank structure comprising:
a substrate;
an insulating layer on the substrate;
an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls;
a corresponding array of vertical light emitting diode devices mounted within the array of bank openings, wherein each vertical light emitting device has a maximum width of 1 μm-100 μm and includes:
a micro p-n diode that includes a plurality of layers including a top p-doped or n-doped layer, a lower p-doped or n-doped layer, and one or more quantum well layers between the top and lower p-doped or n-doped layers, wherein one or more of the plurality of layers is based on II-VI materials or III-V materials;
a top conductive electrode; and
a bottom conductive electrode;
a passivation layer spanning sidewalls of the array of vertical light emitting diode devices and least partially filling the array of bank openings;
one or more integrated circuits interconnected with the bottom conductive electrodes of each vertical light emitting diode device;
an array of via openings in the insulating layer; and
an array of electrical lines out beneath each of the corresponding array of via openings, the array of electrical lines out in electrical contact with the top conductive electrodes of the array of vertical light emitting diode devices.
16. The light emitting diode bank structure of claim 15 , further comprising an array of transparent conductor layers, each transparent conductor layer over and in electrical contact with a corresponding electrical line out and a top conductive electrode of a corresponding vertical light emitting diode device.