Method of forming film
Provided is a method of manufacturing a film, including: applying, onto a substrate, a photocurable composition containing a polymerizable monomer, a photopolymerization initiator, and a photosensitive gas generator that generates a gas through light stimulation to form an applied film; bringing a mold into contact with the applied film; irradiating the applied film with light through the mold to cure the applied film and to generate the gas in the applied film; and releasing the mold from the applied film after the irradiation of the applied film with the light to form a film (cured film) having a predetermined pattern shape on the substrate, in which in the irradiation of the applied film with the light, a reaction rate of a polymerization reaction of the polymerizable monomer in the applied film is higher than a reaction rate of a gas-generating reaction of the photosensitive gas generator in the applied film.
1. A method of manufacturing a film, comprising:
applying, onto a substrate, a photocurable composition containing a polymerizable monomer, a photopolymerization initiator, and a photosensitive gas generator that generates a gas through light stimulation to form an applied film;
bringing a mold into contact with the applied film;
irradiating the applied film with light through the mold to cure the applied film and to generate the gas in the applied film; and
releasing the mold from the applied film after the irradiation of the applied film with the light to form a film having a predetermined pattern shape on the substrate,
wherein in the irradiation of the applied film with the light, a reaction rate of a polymerization reaction of the polymerizable monomer in the applied film is higher than a reaction rate of a gas-generating reaction of the photosensitive gas generator in the applied film, and
wherein the photosensitive gas generator comprises a molecule with a repeating unit of an ethylene oxide group at a non-terminal location.
2. The method according to claim 1 , wherein:
the photopolymerization initiator in the photocurable composition comprises 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone;
the photosensitive gas generator in the photocurable composition comprises a 1,2-naphthoquinonediazide-5-sulfonic acid amide-based compound; and
the light with which the applied film is irradiated has a wavelength of 313±5 nm.
3. The method according to claim 1 , wherein:
the photopolymerization initiator in the photocurable composition comprises 2-hydroxy-2-methyl-1-phenyl-propan-1-one;
the photosensitive gas generator in the photocurable composition comprises a 1,2-naphthoquinonediazide-5-sulfonic acid amide-based compound; and
the light with which the applied film is irradiated has a wavelength of 254±5 nm.
4. The method according to claim 1 , wherein:
the photopolymerization initiator in the photocurable composition comprises 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone;
the photosensitive gas generator in the photocurable composition comprises a 1,2-naphthoquinonediazide-5-sulfonic acid amide-based compound; and
the light with which the applied film is irradiated has a wavelength of 313±5 nm or 254±5 nm.
5. A method of manufacturing a substrate with a circuit, comprising processing a substrate with a film obtained by the manufacturing method according to claim 1 as a mask to form a circuit on the substrate.
6. A method of manufacturing an optical component including:
a substrate; and
a member provided on the substrate and having a predetermined pattern shape,
the method comprising manufacturing the member by the manufacturing method according to claim 1 .
7. The method according to claim 1 , wherein a viscosity of the photocurable composition is 6 cP to 20 cP.
8. The method according to claim 1 , wherein a weight ratio of the photosensitive gas generator to the photocurable composition is 5/102 or more.