Curable resin composition and cured product thereof, encapsulant, and semiconductor device
Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.
1. A curable resin composition comprising:
a polyorganosiloxane (A);
an isocyanurate compound (B); and
a silane coupling agent (C),
the polyorganosiloxane (A) comprising
a polyorganosiloxysilalkylene comprising a structure represented by Formula (I):
wherein R a , R b , R c , R d , R e , and R f are, independently in each occurrence, selected from hydrogen, a monovalent hydrocarbon group, and a monovalent heterocyclic group, where at least one of R a to R f is an aryl group; R g represents, independently in each occurrence, a divalent hydrocarbon group; and s1 and s2 each independently represent an integer of 1 or more.
2. The curable resin composition according to claim 1 ,
wherein the polyorganosiloxane (A) comprises
a polyorganosiloxane having a number-average molecular weight (Mn) of from 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.
3. The curable resin composition according to claim 1 ,
wherein the polyorganosiloxane (A) comprises
a polyorganosiloxane having a molecular-weight dispersity (Mw/Mn) of from 0.95 to 4.00, where the polyorganosiloxane has a weight-average molecular weight of Mw and a number-average molecular weight of Mn as determined by gel permeation chromatography and calibrated with a polystyrene standard.
4. The curable resin composition according to claim 1 ,
wherein the polyorganosiloxane (A) comprises
a polyorganosiloxane (A1) comprising an aliphatic carbon-carbon double bond.
5. The curable resin composition according to claim 1 ,
wherein the polyorganosiloxane (A) comprises
a polyorganosiloxane (A2) comprising a S—H bond.
6. The curable resin composition according to claim 5 ,
wherein the polyorganosiloxane (A) comprises 50 percent by weight or more of the polyorganosiloxane (A2) comprising a S—H bond based on the total amount (100 percent by weight) of the polyorganosiloxane (A).
7. The curable resin composition according to claim 1 ,
wherein the isocyanurate compound (B) comprises
an isocyanurate compound represented by Formula (1):
wherein R x , R y , and R z are each, identically or differently, selected from a group represented by Formula (2) and a group represented by Formula (3):
wherein R 1 and R 2 are each, identically or differently, selected from hydrogen and C 1 -C 8 straight or branched chain alkyl.
8. The curable resin composition according to claim 7 ,
wherein at least one of R x , R y , and R z in Formula (1) is the group represented by Formula (3).
9. A cured product of the curable resin composition according to claim 1 .
10. An encapsulant obtained by using the curable resin composition according to claim 1 .
11. A semiconductor device obtained by using the curable resin composition according to claim 1 .