Semiconductor laser module and method of manufacturing the same

1. A semiconductor laser module comprising:

a substrate;

a device-mounting portion provided on the substrate;

a semiconductor laser device mounted on the device-mounting portion, the semiconductor laser device emitting a laser beam having an optical axis along a first direction;

a collimator lens configured to collimate a component of the laser beam emitted from the semiconductor laser device along a second direction perpendicular to the first direction; and

a lens fixture block having a lens attachment surface perpendicular to a third direction that is perpendicular to the first direction and the second direction and a block fixation surface perpendicular to the third direction,

wherein at least one of ends of the collimator lens along the third direction is fixed to the lens attachment surface of the lens fixture block with a lens fixation resin, and

the block fixation surface of the lens fixture block is opposed to and attached to a side surface of the device-mounting portion which is perpendicular to the third direction with a block fixation resin.

2. The semiconductor laser module as recited in claim 1 , characterized in that the second direction is a direction along a fast axis of the laser beam emitted from the semiconductor laser device.

3. The semiconductor laser module as recited in claim 1 , characterized in that a position of the lens attachment surface of the lens fixture block is located farther away from the device-mounting portion than a position of the block fixation surface of the lens fixture block along the third direction.

4. The semiconductor laser module as recited in claim 1 , characterized in that a groove is formed between the lens attachment surface and the block fixation surface of the lens fixture block for preventing the lens fixation resin from being brought into contact with the device-mounting portion.

5. The semiconductor laser module as recited in claim 1 , characterized in that the device-mounting portion includes a mounting substrate on which the semiconductor laser device is mounted and a spacer having a certain thickness,

wherein the block fixation surface of the lens fixture block is fixed to a side surface of the spacer of the device-mounting portion along the third direction with the block fixation resin.

6. The semiconductor laser module as recited in claim 1 , characterized in that the lens fixation resin is a UV-curable resin or a thermosetting resin.

7. The semiconductor laser module as recited in claim 1 , characterized in that the block fixation resin is a UV-curable resin or a thermosetting resin.

8. The semiconductor laser module as recited in claim 1 , characterized in that an equal amount of the lens fixation resin is present on opposite sides of the collimator lens along the first direction, and

an equal amount of lens fixation resin is present on opposite sides of the collimator lens along the second direction.

9. A method of manufacturing a semiconductor laser module having a semiconductor laser device operable to emit a laser beam having an optical axis along a first direction and a collimator lens configured to collimate a component of the laser beam emitted from the semiconductor laser device along a second direction perpendicular to the first direction, comprising:

mounting the semiconductor laser device to a device-mounting portion;

fixing the device-mounting portion to a substrate;

applying a lens fixation resin to a lens attachment surface formed on a lens fixture block;

inserting an end of the collimator lens along a third direction into the lens fixation resin applied to the lens attachment surface in a state in which the lens attachment surface is perpendicular to the third direction that is perpendicular to the first direction and the second direction;

hardening the lens fixation resin to fix the collimator lens to the lens fixture block;

applying a block fixation resin to a side surface of the device-mounting portion which is perpendicular to the third direction;

bringing the lens fixture block into contact with the block fixation resin such that a block fixation surface of the lens fixture block which is perpendicular to the third direction is opposed to and attached to the side surface;

positioning the collimator lens into a desired location while emitting a laser beam from the semiconductor laser device; and

when the collimator lens has been positioned, hardening the block fixation resin to fix the lens fixture block and the collimator lens relative to the device-mounting portion.

10. The method of manufacturing a semiconductor laser module as recited in claim 9 , characterized in that the second direction is a direction along a fast axis of the laser beam emitted from the semiconductor laser device.

11. The method of manufacturing a semiconductor laser module as recited in claim 9 , characterized in that the inserting the end of the collimator lens into the lens fixation resin comprises equalizing amounts of the lens fixation resin present on opposite sides of the collimator lens along the first direction and equalizing amounts of the lens fixation resin present on opposite sides of the collimator lens along the second direction.

12. The method of manufacturing a semiconductor laser module as recited in claim 9 , characterized in that the device-mounting portion includes a mounting substrate and a spacer having a certain thickness,

wherein the mounting the semiconductor laser device to the device-mounting portion comprises:

mounting the semiconductor laser device to the mounting substrate, and

fixing the mounting substrate to the spacer,

wherein the applying the block fixation resin to the side surface of the device-mounting portion along the third direction comprises applying the block fixation resin to a side surface of the spacer along the third direction.