IP Library Granted Patent US 9,656,348
Granted Patent B2
US 9,656,348 · App. 14/701,856 · Granted May 23, 2017

Laser processing apparatus

Inventor: Masaru Nakamura (Tokyo, JP)
Assignee: Disco Corporation
B23K26/0622B23K26/0066B23K26/032B23K26/083B23K26/0853B23K26/0869B23K26/0876B23K26/364B23K26/402B24C1/06B23K2201/40
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Quick Facts
Patent No.
US 9,656,348
App. No.
14/701,856
Granted
May 23, 2017
Kind
B2
Abstract

A laser processing apparatus includes a holding table for holding a workpiece, a laser beam applying unit for applying a laser beam to the workpiece, a feeding mechanism for relatively moving the holding table and the laser beam applying unit, a detector for applying detection light to the workpiece and detecting the quantity of reflected light obtained by the reflection of the detection light from the workpiece, and a controller for determining whether or not the workpiece is present at a laser beam applying position according to a detection signal output from the detector. The holding table includes a holding member for holding the workpiece under suction and an annular mount member provided so as to surround the holding member for mounting the holding member. The mount member has an upper surface treated by an irregular reflection process for irregularly reflecting light.

Claims (8)

1. A laser processing apparatus comprising:

a holding table for holding a workpiece;

laser beam applying means for applying a laser beam to said workpiece held on said holding table;

moving means for relatively moving said holding table and said laser beam applying means;

detecting means for applying detection light to said workpiece held on said holding table and detecting the quantity of reflected light obtained by the reflection of said detection light from said workpiece; and

control means for determining whether or not said workpiece is present at a laser beam applying position according to a detection signal output from said detecting means;

wherein said holding table includes a holding member for holding said workpiece under suction and an annular mount member provided so as to surround said holding member for mounting said holding member, said mount member having an upper surface treated by an irregular reflection process for irregularly reflecting light.

2. The laser processing apparatus according to claim 1 , wherein said irregular reflection process comprises blasting.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2015
From: NAKAMURA, MASARU
To: DISCO CORPORATION
Reel/Frame 035545/0993 →
Priority Claims (1)
JP 2014-097704 · May 9, 2014 · national
Continuity (1)
Related Publication 20150321284A1 · Nov 12, 2015