Radiator, solderless interconnect thereof and grounding element thereof
A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.
1. A radiator, comprising:
an aperture plate defining multiple slots in first and second transverse directions;
spring probes disposed within each of the multiple slots;
printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit, each of the PCBs being disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes; and
a grounding element interposed between crisscrossing PCB pairs at complementary notches thereof.
2. The radiator according to claim 1 , wherein the aperture plate comprises metallic material and the PCBs are each grounded to the aperture plate via at least one of fasteners and epoxy bond.
3. The radiator according to claim 1 , wherein the spring probes comprise radio frequency (RF) spring probes RF matched with the pad.
4. The radiator according to claim 1 , wherein the major and minor surfaces of the PCBs are plated with conductive surface material insulated from the conductive pad material.
5. The radiator according to claim 1 , wherein the grounding element comprises:
a hairpin element; and
first and second legs extending substantially in parallel with each other from opposite ends of the hairpin element,
each of the first and second legs comprising an exterior facing elastic grip element to grip a first one of the crisscrossing PCB pairs and an interior facing elastic grip element to grip a second one of the crisscrossing PCB pairs.
6. The radiator according to claim 1 , wherein each of the first and second legs comprises a spine element, each of the exterior facing elastic grip elements comprises first and second opposed exterior facing flanges and first and second opposed elastic members by which the first and second opposed exterior facing flanges are elastically coupled to the corresponding spine element and each of the interior facing elastic grip elements comprises first and second opposed interior facing flanges, a first elastic member by which the first interior facing flange is elastically coupled to the spine element of the first leg and a second elastic member by which the second interior facing flange is elastically coupled to the spine element of the second leg.
7. The radiator according to claim 1 , wherein each of the first and second legs comprises a spine element, each of the exterior facing elastic grip elements comprises first and second opposed exterior facing flanges and first and second opposed elastic members by which the first and second opposed exterior facing flanges are elastically coupled to the corresponding spine element and each of the interior facing elastic grip elements comprises first and second dimple arrays respectively disposed along the respective spine elements of the first and second legs.
8. A solderless interconnect, comprising:
an aperture plate defining a slot;
a spring probe disposed within the slot; and
a printed circuit board (PCB) having major and minor surfaces,
the PCB being recessed on either side of a portion of one of the minor surfaces to define a pad, which is plated with conductive pad material electrically interconnected with a PCB circuit, and
the PCB being disposed with the one of the minor surfaces inserted into the slot such that the pad forms a horizontal blind-mate contact with the spring probe that is in-plane with a PCB plane.
9. The solderless interconnect according to claim 8 , wherein the aperture plate comprises metallic material and the PCB is grounded to the aperture plate via at least one of fasteners and epoxy bond.
10. The solderless interconnect according to claim 8 , wherein the spring probe is plural in number and provided as spring probes disposed within the slot along a longitudinal length of the slot.
11. The solderless interconnect according to claim 10 , wherein the PCB defines multiple pads for respective horizontal blind-mate connections with the spring probes that are in-plane with the PCB plane.
12. The solderless interconnect according to claim 8 , wherein the spring probe comprises a radio frequency (RF) spring probe RF matched with the pad.
13. The solderless interconnect according to claim 8 , wherein the major and minor surfaces of the PCB are plated with conductive surface material insulated from the conductive pad material.