System interconnect for integrated circuits
An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.
1. An electronic device to transmit data comprising:
a package substrate; and
a plurality of integrated circuits coupled to the package substrate, at least one integrated circuit comprising a topside connector coupled to a cable receptacle via a first cable, the cable receptacle also coupled to a printed circuit board via a second cable separate from the first cable, the second cable receiving a sideband signal from the printed circuit board, wherein the at least one integrated circuit is connected to a backplane connector through the cable receptacle, and wherein a backplane package substrate enables data transmission between the at least one integrated circuit and a switch fabric silicon without a repeater.
2. The electronic device of claim 1 , wherein the package substrate does not include the first cable.
3. The electronic device of claim 1 , wherein the cable receptacle transmits data to a switch fabric silicon.
4. The electronic device of claim 1 , wherein the first cable is one of a coaxial cable, a micro-coaxial cable, twin-axial cable, or a flexible printed circuit.
5. The electronic device of claim 1 , wherein the cable receptacle is a CXP cable receptacle.
6. An electronic device to transmit data comprising:
an integrated circuit coupled to a package substrate, the integrated circuit having a topside connector coupled to a first cable; and
a double-ended cable receptacle that is electrically coupled to the first cable from the topside connector and a second cable separate from the first cable that is electrically coupled to a chassis panel comprising a printed circuit board, the second cable receiving a sideband signal from the printed circuit board, wherein the integrated circuit is connected to a backplane connector through the double-ended cable receptacle, and wherein a backplane package substrate enables data transmission between the integrated circuit and a switch fabric silicon without a repeater.
7. The electronic device of claim 6 , wherein the double-ended cable receptacle transmits the data from the integrated circuit to the printed circuit board.
8. The electronic device of claim 6 , wherein the topside connector is a network interface connector integrated into the first cable.
9. The electronic device of claim 6 , wherein the topside connector is a network interface connector that attaches to the first cable through one of a low insertion force connector and a land grid array.
10. A system to transmit data comprising:
an integrated circuit coupled to a first package substrate, the integrated circuit to have a topside connector coupled to a first cable;
a double-ended cable receptacle coupled to the first cable that is to transmit the data from the topside connector of the integrated circuit of the first package substrate to a chassis panel comprising a printed circuit board, the double-ended cable receptacle also coupled to a second cable separate from the first cable, the second cable receiving a sideband signal from the printed circuit board; and
a backplane printed circuit board comprising a switch fabric silicon, wherein the integrated circuit is connected to a backplane connector through the double-ended cable receptacle, and wherein the backplane printed circuit board enables data transmission between the integrated circuit and the switch fabric silicon without a repeater.
11. The system of claim 10 , wherein the double-ended cable receptacle resides within the backplane printed circuit board.
12. The system of claim 10 , wherein the first package substrate does not include the first cable.
13. The system of claim 10 , wherein the double-ended cable receptacle transmits data to the switch fabric silicon.
14. The system of claim 10 , wherein the first cable is one of a coaxial cable, a micro-coaxial cable, a twin-axial cable, or a flexible printed circuit board cable.
15. The system of claim 10 , wherein the first cable comprises a connector, wherein the connector is a quad small form-factor pluggable connector.