III-N transistors with enhanced breakdown voltage
Techniques related to III-N transistors having enhanced breakdown voltage, systems incorporating such transistors, and methods for forming them are discussed. Such transistors include a hardmask having an opening over a substrate, a source, a drain, and a channel between the source and drain, and a portion of the source or the drain disposed over the opening of the hardmask.
1. A transistor comprising:
a hardmask disposed over a substrate, wherein the hardmask comprises at least one opening;
a source, a drain, and a gate coupled channel between the source and the drain, wherein the channel comprises gallium nitride and is disposed over the hardmask, and wherein the drain comprises an extrinsic drain portion proximal to the channel and an intrinsic drain portion distal to the channel; and
a polarization layer disposed over at least the extrinsic drain portion, wherein a portion of at least one of the source or the drain is disposed over the opening of the hardmask.
2. The transistor of claim 1 , wherein the extrinsic drain portion comprises a material having a wider band gap than the channel.
3. The transistor of claim 1 , wherein the gate comprises a gate stack including a non-epitaxial dielectric proximal to the channel.
4. The transistor of claim 3 , wherein the source comprises an extrinsic source portion proximal to the channel and an intrinsic source portion distal to the channel, wherein the polarization layer is disposed over the extrinsic source portion and has an opening over the channel.
5. The transistor of claim 1 , wherein the portion of the source is disposed over the opening of the hardmask, and wherein the extrinsic drain portion comprises a material having a wider band gap than the channel.
6. The transistor of claim 5 , wherein the material comprises aluminum gallium nitride.
7. The transistor of claim 6 , wherein the extrinsic drain portion comprises a graded extrinsic drain portion having an increasing aluminum percentage from a junction between the channel and the extrinsic drain portion toward the intrinsic drain portion.
8. The transistor of claim 6 , wherein the aluminum gallium nitride comprises a percentage of aluminum of no more than 10% with a balance of gallium.
9. The transistor of claim 6 , wherein a predetermined breakdown voltage of the transistor is at least 10 volts and a lateral length of the extrinsic drain portion is less than 45 nm.
10. The transistor of claim 1 , wherein the intrinsic drain portion is disposed under the hardmask and extends laterally under the hardmask.
11. The transistor of claim 10 , wherein the extrinsic drain portion comprises a vertical extrinsic drain portion disposed over the opening of the hardmask and extending between the channel and the intrinsic drain.
12. The transistor of claim 11 , further comprising:
a second hardmask comprising at least one second opening disposed between the hardmask and the substrate; and
a III-N material layer disposed over the second hardmask, wherein the intrinsic drain portion is disposed over the III-N material layer.
13. The transistor of claim 12 , wherein the second opening is laterally offset from the vertical extrinsic drain portion by one fourth of a pitch between the vertical extrinsic drain portion and a second vertical extrinsic drain portion.
14. The transistor of claim 11 , wherein a predetermined breakdown voltage of the transistor is at least 100 volts and an effective length of the extrinsic drain portion is less than 440 nm.
15. A method for fabricating a transistor comprising:
forming a hardmask over a substrate, wherein the hardmask comprises at least one opening;
forming a source, a drain, and a channel between the source and the drain, wherein the channel comprises gallium nitride and is formed over the hardmask, wherein forming the drain comprises forming an extrinsic drain portion proximal to the channel and forming an intrinsic drain portion distal to the channel, and wherein a portion of at least one of the source or the drain is disposed over the opening of the hardmask;
disposing a polarization layer over at least the extrinsic drain portion; and
forming a gate over the channel.
16. The method of claim 15 , wherein the extrinsic drain portion comprises a material having a wider band gap than the channel.
17. The method of claim 15 , wherein forming the extrinsic drain portion comprises laterally epitaxially growing a material having a wider band gap than the channel.
18. The method of claim 15 , wherein forming the extrinsic drain portion comprises laterally epitaxially growing a graded aluminum gallium nitride having an increasing aluminum percentage from a junction between the channel and the extrinsic drain portion toward the intrinsic drain portion.
19. The method of claim 15 , wherein the intrinsic drain portion is disposed under the hardmask and extends laterally under the hardmask.
20. The method of claim 19 , further comprising:
forming a second hardmask comprising at least one second opening between the hardmask and the substrate; and
epitaxially overgrowing a III-N material layer over the second hardmask, wherein the intrinsic drain portion is formed over the III-N material layer.
21. A system comprising:
a power management integrated circuit further comprising a transistor including:
a hardmask over a substrate, wherein the hardmask comprises at least one opening;
a source, a drain, and a gate coupled channel between the source and the drain, wherein the channel comprises gallium nitride and is disposed over the hardmask, and wherein the drain comprises an extrinsic drain portion proximal to the channel and an intrinsic drain portion distal to the channel; and
a polarization layer disposed over at least the extrinsic drain portion, wherein a portion of at least one of the source or the drain is disposed over the opening of the hardmask.
22. The system of claim 21 , wherein the portion of the source is disposed over the opening of the hardmask, and wherein the extrinsic drain portion comprises aluminum gallium nitride having a percentage of aluminum of no more than 10% with a balance of gallium.
23. The system of claim 21 , wherein the intrinsic drain portion is disposed under the hardmask and extends laterally under the hardmask, and wherein the extrinsic drain portion comprises a vertical extrinsic drain portion disposed over the opening of the hardmask and extending between the channel and the intrinsic drain.
24. The system of claim 23 , the transistor further comprising:
a second hardmask comprising at least one second opening disposed between the hardmask and the substrate; and
a III-N material layer disposed over the second hardmask, wherein the intrinsic drain portion is disposed over the III-N material layer.