Method for forming memory device
A method for forming a memory device is provided. The method includes forming a plurality of memory cells. The method also includes performing a first baking on the memory cells. The method further includes setting a specified current, and after performing the first baking, performing a test process on the memory cells. The test process includes reading the current of the memory cells. When the read current of the memory cells is larger than or equal to the specified current, the test process of the memory cell is done. When the read current of the memory cells is smaller than the specified current, a re-forming process is performed on the memory cells to form a plurality of re-formed memory cells, and then the test process is performed on the re-formed memory cells.
1. A method for forming a memory device, comprising:
forming a plurality of memory cells;
performing a first baking on the memory cells;
setting a specified current; and
after performing the first baking, performing a test process on the memory cells, wherein the test process comprises:
reading a current of the memory cells, wherein when the read current of the memory cells is larger than or equal to the specified current, the test process of the memory cells is finished, or when the read current of the memory cells is smaller than the specified current, performing a re-forming process on the memory cells to form a plurality of re-formed memory cells, and performing the test process on the re-formed memory cells.
2. The method as claimed in claim 1 , further comprising:
applying an initial reset voltage to the memory cells;
applying a set voltage to the memory cells after the initial reset voltage is applied;
applying a reset voltage to the memory cells after the set voltage is applied; and
performing a second baking on the memory cells after the reset voltage is applied.
3. The method as claimed in claim 2 , wherein after the reset voltage is applied to the memory cells and before the second baking, the first baking, setting the specified current and the test process are performed on the memory cells.
4. The method as claimed in claim 2 , wherein before applying the reset voltage to the memory cells and after the set voltage is applied to the memory cells, the first baking, setting the specified current and the test process are performed on the memory cells.
5. The method for forming a memory device as claimed in claim 2 , wherein before applying the set voltage to the memory cells and after the initial reset voltage is applied to the memory cells, the first baking, setting the specified current, and the test process are performed on the memory cells.
6. The method as claimed in claim 2 , wherein after the memory cells are formed and before applying the initial reset voltage to the memory cells, the first baking, setting the specified current and the test process are performed on the memory cells.
7. The method as claimed in claim 2 , wherein a temperature range of the second baking is lower than that of the first baking.
8. The method for forming a memory device as claimed in claim 2 , wherein a time of the second baking is longer than that of the first baking.
9. The method for forming a memory device as claimed in claim 7 , wherein the temperature range of the first baking is between 260° C. and 280° C.
10. The method for forming a memory device as claimed in claim 1 , further comprising setting an upper limit of a number of re-forming iteration, and wherein the test process further comprises checking the number of re-forming iteration of the memory cells, wherein when the number of re-forming iteration is equal to the upper limit of the number of re-forming iteration, then the test process of the memory cells is ended, or when the number of re-forming iteration is less than the upper limit of the number of re-forming iteration, then the re-forming process is performed on the memory cells, and the test process is performed again on the memory cells.