Microphone sensor

1. A microphone, comprising:

an audio detection module having a vibration film configured to output a capacitance signal by vibrating by audio introduced from an exterior and a piezoresistive element configured to output a piezoresistive signal by a sound pressure of the audio; and

a semiconductor chip having a single amplifier electrically connected to the audio detection module to receive both the capacitance signal and the piezoresistive signal from the audio detection module and configured to amplify the capacitance signal and the piezoresistive signal to an electrical signal, wherein the single amplifier includes:

an input terminal configured to receive an input of the capacitance signal;

a first resistor connected to the input terminal and connected to the piezoresistive element;

an output terminal configured to amplify and output the capacitance signal and the piezoresistive signal to the electrical signal; and a second resistor connected to the input terminal and the output terminal and connected to the piezoresistive element.

2. The microphone of claim 1 , wherein the audio detection module includes:

first and second pads connected to the piezoresistive element; and

an output pad configured to output the capacitance signal to the semiconductor chip.

3. The microphone of claim 1 , wherein the amplifier is an inverting amplifier or a non-inverting amplifier.

4. The microphone of claim 2 , wherein the first pad is connected to the first resistor, and the second pad is connected to the second resistor.

5. The microphone of claim 2 , wherein the piezoresistive element is changed based on the sound pressure and is connected to the first and second resistors through the first and second pads.

6. The microphone of claim 2 , wherein the input terminal includes:

a non-inverting input terminal connected to the output pad that outputs the capacitance signal; and

an inverting input terminal connected to the first and second resistors and the piezoresistive element.

7. The microphone of claim 2 , wherein the input terminal includes:

a non-inverting input terminal connected to the ground; and

an inverting input terminal connected to an output pad that outputs the capacitance signal, the first and second resistors, and the piezoresistive element.

8. A microphone, comprising:

an audio detection module configured to output a capacitance signal that changes by a vibration film that vibrates by audio introduced from an exterior and a fixed electrode and a piezoresistive signal occurring when a sound pressure is applied to a piezoresistive element by the audio; and a semiconductor chip including a single amplifier configured to receive both the capacitance signal and the piezoresistive signal and amplify the capacitance signal and the piezoresistive signal to an electrical signal, wherein the single amplifier includes:

a non-inverting input terminal configured to receive an input of the capacitance signal;

an inverting input terminal configured to receive an input of the piezoresistive signal connected to first and second resistors; and an output terminal configured to amplify and output the capacitance signal and the piezoresistive signal to the electrical signal.

9. The microphone of claim 8 , wherein the amplifier is configured to amplify the capacitance signal and the piezoresistive signal using the piezoresistive element and the first and second resistors.

10. The microphone of claim 8 , wherein the audio detection module includes:

a first pad and a second pad connected to the piezoresistive element; and

an output pad connected to the non-inverting input terminal and configured to output the capacitance signal to the semiconductor chip.

11. The microphone of claim 10 , wherein the first and second resistors are connected to a piezoresistive element through the first and second pads.

12. A microphone, comprising:

an audio detection module including a vibration film configured to output a capacitance signal by vibrating by audio introduced from an exterior and a piezoresistive element configured to output a piezoresistive signal by the audio; and a semiconductor chip including a single amplifier electrically connected to the audio detection module to receive both the capacitance signal and the piezoresistive signal from the audio detection module and configured to amplify the capacitance signal and the piezoresistive signal to an electrical signal,

wherein the amplifier comprises: a non-inverting input terminal connected to the ground;

an inverting input terminal configured to receive an input of the capacitance signal;

a first resistor connected to the inverting input terminal and connected to the piezoresistive element; a second resistor connected to the inverting input terminal and connected to the piezoresistive element; and an output terminal connected to the second resistor and configured to amplify and output the capacitance signal to the electrical signal based on the piezoresistive element, the first resistor, and the second resistor.

13. The microphone of claim 12 , wherein the audio detection module includes:

a first pad connected to the piezoresistive element and connected to the first resistor;

a second pad connected to the piezoresistive element and connected to the second resistor; and

an output pad connected to the inverting input terminal and configured to output the capacitance signal to the inverting input terminal.