Heat management and removal assemblies for semiconductor devices

1. A heat management and removal assembly for an electronic device surface, the assembly comprising:

a manifold body at least partly defining an inlet manifold, an outlet manifold, and a chamber, the manifold body supporting the electronic device surface facing the chamber;

a coolant flow insert disposed within the chamber between the electronic device surface and the manifold body; and

an elongated wall disposed within the chamber between the coolant flow insert and the manifold body, the elongated wall at least partly defining an inlet passage and an outlet passage within the chamber,

the inlet manifold being in fluid communication with the outlet passage via the inlet passage, and

the inlet passage being in fluid communication with the outlet manifold via the outlet passage,

the inlet passage extending toward the outlet manifold, the outlet passage extending toward the inlet manifold,

the inlet passage being in fluid communication with an upper surface of the coolant flow insert via a plurality of inlet ports,

the upper surface of the coolant flow insert being in fluid communication with the outlet passage via a plurality of outlet ports,

wherein the upper surface of the coolant flow insert includes a plurality of fins extending toward the electronic device surface.

2. The assembly of claim 1 wherein the inlet and outlet manifolds are parallel to each other and perpendicular to the inlet and outlet passages.

3. The assembly of claim 1 wherein the upper surface of the coolant flow insert includes an open cell matrix disposed between the plurality of outlet ports and the plurality of inlet ports.

4. The assembly of claim 3 wherein the open cell matrix is a foam.

5. The assembly of claim 3 wherein the coolant flow insert includes a tray that supports the open cell matrix and that defines the plurality of inlet ports and the plurality of outlet ports.

6. The assembly of claim 1 wherein the inlet passage is parallel to the outlet passage.

7. The assembly of claim 6 wherein the inlet and outlet manifolds are parallel to each other and perpendicular to the inlet and outlet passages.

8. The assembly of claim 1 wherein the inlet and outlet passages are separated by the elongated wall.

9. The assembly of claim 1 , further comprising a lower tray disposed within the chamber between the coolant flow insert and the manifold body, the lower tray including the elongated wall,

wherein the lower tray at least partly defines

the inlet passage and the outlet passage,

an inlet opening providing fluid communication between the inlet passage and the inlet manifold, and

an outlet opening providing fluid communication between the outlet passage and the outlet manifold.

10. The assembly of claim 9 wherein the coolant flow insert includes an upper tray that defines the plurality of outlet ports and the plurality of inlet ports, the upper tray being disposed between the lower tray and the electronic device surface, the lower tray including an outer periphery that forms a seal with an underside of the upper tray, the elongated wall also forming a seal with an underside of the upper tray.

11. The assembly of claim 10 wherein the upper tray includes the plurality of fins.

12. A method for cooling an electronic device surface, the method comprising:

supporting a coolant flow insert facing an inlet passage and an outlet passage; providing fluid communication between the inlet passage and an inlet manifold and between the outlet passage and an outlet manifold;

providing fluid communication between the inlet passage and an upper surface of the coolant flow insert;

providing fluid communication between the upper surface of the coolant flow insert and the outlet passage;

flowing coolant to the inlet passage via the inlet manifold;

flowing the coolant from the inlet passage to the upper surface of the coolant flow insert via a plurality of inlet ports, a flow direction through the plurality of inlet ports being perpendicular to a flow direction through the inlet passage;

flowing the coolant across the upper surface of the coolant flow insert to the outlet passage via a plurality of outlet ports, a flow direction through the plurality of outlet ports being perpendicular to a flow direction through the outlet passage; and

flowing the coolant through the outlet passage and to the outlet manifold,

wherein flowing the coolant across the upper surface of the coolant flow insert includes flowing the coolant across a plurality of fins extending from the coolant flow insert toward the electronic device surface.

13. The method of claim 12 wherein the inlet and outlet passages are parallel to each other, and

a flow direction of coolant across the upper surface of the coolant flow insert is transverse to the inlet and outlet passages.

14. The method of claim 13 wherein the inlet and outlet passages are perpendicular to the inlet and outlet manifolds.

15. The method of claim 12 wherein the coolant flow insert includes an open cell matrix supported on a tray above the inlet and outlet passages, the tray including a plurality of inlet ports providing fluid communication between the inlet passage and the open cell matrix and a plurality of outlet ports providing fluid communication between the open cell matrix and the outlet passage.

16. The method of claim 12 wherein the coolant flow insert includes a foam body, and

the method further comprises fabricating the foam body using additive manufacturing.

17. A heat management and removal assembly for electronic devices, the assembly comprising:

a body at least partly defining an inlet manifold, an outlet manifold, a plurality of inlet passages, and a plurality of outlet passages, the body supporting a plurality of electronic device surfaces in a parallel configuration, the inlet manifold being in fluid communication with the plurality of inlet passages, the outlet manifold being in fluid communication with the plurality of outlet passages, the inlet and outlet manifolds being arranged parallel to each other and perpendicular to the plurality of inlet passages and the plurality of outlet passages and

a plurality of coolant flow inserts, each coolant flow insert of the plurality of coolant flow inserts being disposed between a respective electronic device surface of the plurality of electronic device surfaces and a respective inlet passage of the plurality of inlet passages and a respective outlet passage of the plurality of outlet passages,

each inlet passage of the plurality of inlet passages extending from the inlet manifold toward the outlet manifold, each outlet passage of the plurality of outlet passages extending from the outlet manifold toward the inlet manifold,

each inlet passage of the plurality of inlet passages being in fluid communication with an upper surface of a respective coolant flow insert of the plurality of coolant flow inserts via a plurality of inlet ports, each outlet passage of the plurality of outlet passages being in fluid communication with the upper surface of the respective coolant flow insert via a plurality of outlet ports,

wherein the upper surface of each coolant flow insert of the plurality of coolant flow inserts includes a plurality of fins extending toward the respective electronic device surface.

18. The assembly of claim 17 wherein each coolant flow insert includes

an elongated wall that at least partly defines the respective inlet passage and the respective outlet passage, and

a lower tray defining

an inlet opening providing fluid communication between the respective inlet passage and the inlet manifold, and

an outlet opening providing fluid communication between the respective outlet passage and the outlet manifold.

19. The assembly of claim 17 wherein each coolant flow insert includes an open cell matrix.

20. The assembly of claim 1 , wherein the plurality of fins form a herringbone pattern on the upper surface of the coolant flow insert.