Semiconductor device and method of manufacturing same

1. A semiconductor device comprising:

a semiconductor substrate with oppositely outwardly facing first and second sides;

two transistors located at the first side of the semiconductor substrate with respective source regions in the semiconductor substrate and respective drains for the transistors in a common diffusion region in the semiconductor substrate;

a respective gate and a respective gate insulating layer for each transistor on the first side of the substrate;

resistance change elements located at the second side of the semiconductor substrate; and

respective wirings located at the first side of the substrate,

wherein,

the sources of the two transistors are electrically connected to respective first electrodes of the resistance change elements via respective low resistance sections located in the substrate,

each wiring is connected to a respective low resistance section,

second electrodes of the resistance change elements are commonly connected to a bit line,

the drains are commonly connected to a select line, and

the gates are connected to separate respective word lines.

2. The semiconductor device of claim 1 , comprising an insulating film on the second side of the substrate, wherein:

the insulating film has openings to the semiconductor substrate, and

each resistance change element is connected to its respective transistor source through a respective one of the openings.

3. The semiconductor device according to claim 2 , wherein:

each resistance change element includes the first electrode, a memory section, and the second electrode in this order from the second side of the semiconductor substrate, and

the first electrode of each resistance change element is embedded in the respective opening, and connected to its transistor source via a silicide region.

4. The semiconductor device according to claim 1 , wherein:

each resistance change element includes the first electrode, a memory section and the second electrode in this order from the second side of the semiconductor substrate, and

the memory section of each resistance change element is embedded in the respective opening.

5. The semiconductor device according to claim 1 , wherein:

each resistance change element includes the first electrode, a memory section, and the second electrode in this order from the second side of the semiconductor substrate, and

the first electrode of each resistance change element is connected to its transistor source via a silicide region.

6. The semiconductor device according to claim 1 , wherein at each resistance change element is a spin transfer torque-magnetic tunnel junction.

7. The semiconductor device according to claim 1 , wherein:

each resistance change element includes an ion source layer and a resistance change layer, as a memory section,

the ion source layer of each resistance change element includes an ionizable metallic element, and one or more chalcogen elements selected from the group consisting of (Te), sulfur (S), and selenium (Se), and

each resistance change layer comprises a material having a resistance value higher than a resistance value of the ion source layer.

8. A semiconductor device comprising:

a Fin-FET transistor with oppositely facing first and second sides, the Fin-FET having a plurality of fins, each fin having a source portion, a drain portion and a channel portion;

source wiring connected to the source portions of the transistor;

a resistance change element located at the first side of the transistor, the resistance change element having a first end connected to the source wiring and a second end connected to a bit line;

another wiring located at the second side of the transistor, the another wiring connected to the source wiring;

drain wiring connected to the drain portions and a select line; and

gate wiring over the channel portions and connected to a word line.

9. The semiconductor device of claim 8 , wherein the Fin-FET has three fins.