IP Library Granted Patent US 9,698,276
Granted Patent B2
US 9,698,276 · App. 14/950,301 · Granted Jul 4, 2017

Semiconductor device, module, and electronic device

Inventor: Shunpei Yamazaki (Tokyo, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/7869H01L27/1225H01L27/1248H01L29/78603H01L29/78606H01L29/78648H01L29/78696
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Quick Facts
Patent No.
US 9,698,276
App. No.
14/950,301
Granted
Jul 4, 2017
Kind
B2
Abstract

Provided is an element with stable electrical characteristics or a device including plural kinds of elements with stable electrical characteristics. The semiconductor device includes a first insulator, a transistor over the first insulator, a second insulator over the transistor, and a third insulator over the second insulator. The second insulator includes an opening reaching the first insulator. The opening is filled with a fourth insulator. The first insulator, the third insulator, and the fourth insulator each have a lower hydrogen-transmitting property than the second insulator.

Claims (56)

1. A semiconductor device comprising:

a first insulator;

a transistor over the first insulator;

a second insulator over the transistor; and

a third insulator over the second insulator,

wherein the second insulator comprises an opening reaching the first insulator, wherein the opening is filled with a fourth insulator,

wherein the first insulator, the third insulator, and the fourth insulator each have a lower hydrogen-transmitting property than the second insulator, and

wherein the opening surrounds the transistor.

2. The semiconductor device according to claim 1 , wherein a channel formation region of the transistor comprises an oxide semiconductor.

3. A module comprising:

the semiconductor device according to claim 1 ; and

a printed wiring board.

4. An electronic device comprising:

the semiconductor device according to claim 1 or the module according to claim 3 ; and

at least one of a speaker, an operation key, and a battery.

5. A semiconductor device comprising:

a first insulator;

a transistor over the first insulator;

a second insulator over the transistor; and

a third insulator over the second insulator,

wherein the second insulator includes a first opening and a second opening reaching the first insulator and the transistor, respectively,

wherein the first opening is filled with a fourth insulator, wherein the second opening is filled with a conductor,

wherein the first insulator, the third insulator, the fourth insulator, and the conductor each have a lower hydrogen-transmitting property than the second insulator, and

wherein the first opening surrounds the transistor.

6. The semiconductor according to claim 5 ,

wherein the conductor comprises a first region and a second region, and

wherein the first region has a lower hydrogen-transmitting property than the second region.

7. The semiconductor device according to claim 6 , wherein the first region is interposed between the second region and each of the second insulator and the third insulator.

8. The semiconductor device according to claim 6 , wherein the first region comprises a region that is in contact with the transistor.

9. The semiconductor device according to claim 6 , wherein the first region comprises a region that is in contact with side surfaces of the second opening.

10. The semiconductor device according to claim 6 , wherein the first region comprises a region where nitrogen concentration is higher than nitrogen concentration of the second region.

11. The semiconductor device according to claim 6 , wherein the first region comprises a hydrogen absorbing metal.

12. The semiconductor device according to claim 5 , wherein a channel formation region of the transistor comprises an oxide semiconductor.

13. A module comprising:

the semiconductor device according to claim 5 ; and

a printed wiring board.

14. An electronic device comprising:

the semiconductor device according to claim 5 or the module according to claim 13 ; and

at least one of a speaker, an operation key, and a battery.

15. A semiconductor device comprising:

a first transistor;

a first insulator over the first transistor;

a second insulator over the first insulator;

a second transistor over the second insulator;

a third insulator over the second transistor; and

a fourth insulator over the third insulator,

wherein the third insulator comprises an opening reaching the second insulator, wherein the opening is filled with a fifth insulator,

wherein the second insulator, the fourth insulator, and the fifth insulator each have a lower hydrogen-transmitting property than the third insulator, and

wherein the opening surrounds the second transistor.

16. The semiconductor device according to claim 15 , wherein a channel formation region of the second transistor comprises an oxide semiconductor.

17. A module comprising:

the semiconductor device according to claim 15 ; and

a printed wiring board.

18. An electronic device comprising:

the semiconductor device according to claim 15 or the module according to claim 17 ; and

at least one of a speaker, an operation key, and a battery.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2015
From: YAMAZAKI, SHUNPEI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 037130/0906 →
Priority Claims (1)
JP 2014-242064 · Nov 28, 2014 · national
Continuity (1)
Related Publication 20160155850A1 · Jun 2, 2016