Gas barrier film and gas barrier film production method
The present invention is aiming to provide a gas barrier film having excellent gas barrier properties and also having superior transparency and the like, and an efficient method for producing such a gas barrier film. The present invention provides a gas barrier film having a gas barrier layer on a base material, and a method for producing such a gas barrier film, in which the gas barrier layer includes, from the surface side toward the base material side, a first region and a second region having different refractive indices, the value of the refractive index in the first region is adjusted to a value within the range of 1.50 to 1.68, and the value of the refractive index in the second region is adjusted to a value within the range of 1.40 to below 1.50.
1. A method for producing a gas barrier film having a gas barrier layer on a base material, the method comprising the following steps (1) to (3):
(1) a polysilazane layer forming step of forming a polysilazane layer on the base material;
(2) a seasoning step of performing seasoning of the polysilazane layer at a temperature of 15° C. to 35° C. for 24 hours to 240 hours to adjust the refractive index of the polysilazane layer to a value within the range of 1.50 to 1.58; and then
(3) an ion implantation step of implanting ions into the polysilazane layer, and forming a gas barrier layer including, from the surface side toward the base material side, a first region having a refractive index of a value within the range of 1.50 to 1.68, and a second region having a refractive index of a value within the range of 1.40 to below 1.50,
wherein the yellowness index (YI) of the gas barrier layer is adjusted to a value of 1.0 to 3.6,
the total light transmission (Tt) of the gas barrier layer is adjusted to a value of 88% or more, and
the water vapor transmission rate (WVTR) of the gas barrier layer is adjusted to a value of 0.05 g (m 2 ·day) or less.
2. The method for producing a gas barrier film according to claim 1 , wherein the film density in the first region is adjusted to a value within the range of 2.3 g/cm 3 to 3.0 g/cm 3 .
3. The method for producing a gas barrier film according to claim 1 , wherein the thickness of the first region is adjusted to a value within the range of 10 nm to 30 nm.
4. The method for producing a gas barrier film according to claim 1 , wherein in the first region, when the amount of oxygen measured by XPS is designated as X mol %, the amount of nitrogen is designated as Y mol %, and the amount of silicon is designated as Z mol %, the ratio X/Z is adjusted to a value within the range of 1.0 to 2.5, and the ratio Y/Z is adjusted to a value within the range of 0 to 0.5.
5. The method for producing a gas barrier film according to claim 1 , wherein in the first region, the amount of oxygen measured by XPS is designated as X mol %, the amount of silicon is designated as Z mol %, and a curve of the ratio X/Z from the surface side toward the base material has a minimum point.
6. The method for producing a gas barrier film according to claim 1 , wherein in the first region, the amount of silicon measured by XPS is adjusted to a value within the range of 25 to 45 mol %, the amount of oxygen is adjusted to a value within the range of 54 to 74 mol %, and the amount of nitrogen is adjusted to a value within the range of 0.1 to 15 mol %, relative to a total amount of the amount of silicon, the amount of oxygen, and the amount of nitrogen.