Electronic device and method for manufacturing the same

1. An electronic device comprising:

at least one component;

an electrode which is placed on the at least one component;

a conductor which includes a first conductor section and two second conductor sections connected by the first conductor section, the first conductor section including an electrode contact surface in contact with the electrode along a surface of the electrode, the two second conductor sections being physically connected to two respective edges of the first conductor section, extending in respective directions away from the electrode and including respective inclined surfaces inclined in directions toward a central axis passing through a center of the electrode and perpendicular to the surface of the electrode;

an insulator which is in contact with the two second conductor sections from sides opposite to the central axis and encloses the conductor and the electrode;

a case which houses the at least one component, the electrode, the conductor, and the insulator; and

a board which is electrically connected to the at least one component and supports the at least one component, wherein:

a space where the insulator is not arranged is defined between the two second conductor sections,

the conductor further includes a third conductor section which is physically connected to an end on a side opposite to a connection with the first conductor section of each of the two second conductor sections to extend in a direction away from the central axis and faces the board,

the insulator is arranged between the board and the third conductor section,

the at least one component, the electrode, the conductor, the insulator, and the board compose each of at least two structures,

the conductor further includes a fourth conductor section which electrically connects the third conductor sections of the at least two structures, and

the at least two structures are arranged symmetrically with respect to the fourth conductor section.

2. The electronic device according to claim 1 , wherein a coefficient of thermal expansion of the case is lower than a coefficient of thermal expansion of the conductor and is lower than a coefficient of thermal expansion of the insulator.

3. The electronic device according to claim 1 , further comprising:

an auxiliary conductor which is provided in the space and is in contact with the first conductor section.

4. The electronic device according to claim 1 , wherein a coefficient of thermal expansion of the insulator is higher than a coefficient of thermal expansion of the conductor.

5. The electronic device according to claim 1 , wherein:

the at least one component comprises a plurality of components; and

the first conductor section extends in a direction, in which the plurality of components are arrayed, and is electrically connected to the plurality of components.

6. The electronic device according to claim 1 , wherein a thickness of each of the two second conductor sections is smaller than a thickness of the first conductor section.

7. The electronic device according to claim 1 , wherein each of the respective inclined surfaces is flat.

8. The electronic device according to claim 1 , wherein each of the respective inclined surfaces is curved.

9. A method for manufacturing an electronic device including at least one component, an electrode, a conductor having a first conductor section and two second conductor sections connected by the first conductor section, and an insulator, the method comprising:

bringing the first conductor section of the conductor into contact with the electrode placed on the at least one component along a surface of the electrode;

forming respective inclined surfaces which are inclined in directions toward a central axis passing through a center of the electrode and perpendicular to the surface of the electrode at the two second conductor sections of the conductor which are physically connected to two edges of the first conductor section, and extend in respective directions away from the electrode;

enclosing the conductor and the electrode while bringing the insulator into contact with the two second conductor sections from sides opposite to the central axis;

housing the at least one component, the electrode, the conductor, and the insulator in a case;

preparing a board which supports the at least one component;

arranging the board so as to face a third conductor section of the conductor which is physically connected to an end on a side opposite to a connection with the first conductor section of each of the two second conductor sections to extend in a direction away from the central axis;

preparing at least two structures which are each composed of the at least one component, the electrode, the conductor, the insulator, and the board;

connecting the third conductor sections of the at least two structures electrically by a fourth conductor section; and

arranging the at least two structures symmetrically with respect to the fourth conductor section, wherein:

a space where the insulator is not arranged is defined between the two second conductor sections, and

the step of enclosing the conductor and the electrode in the insulator includes arranging the insulator between the board and the third conductor section.

10. The method for manufacturing the electronic device according to claim 9 , wherein a coefficient of thermal expansion of the case is lower than a coefficient of thermal expansion of the conductor and is lower than a coefficient of thermal expansion of the insulator.

11. The method for manufacturing the electronic device according to claim 9 , further comprising:

providing an auxiliary conductor which is in contact with the first conductor section in the space.

12. The method for manufacturing the electronic device according to claim 9 , wherein:

the at least one component comprises a plurality of components; and

the step of bringing the first conductor section into contact with the electrode includes connecting the first conductor section to the plurality of components electrically.

13. The method for manufacturing the electronic device according to claim 9 , further comprising:

curing the insulator that encloses the conductor.