Ion assisted deposition for rare-earth oxide based thin film coatings on process rings
A method of manufacturing an article comprises providing a ring for an etch reactor. Ion assisted deposition (IAD) is then performed to deposit a protective layer on at least one surface of the ring, wherein the protective layer is a plasma resistant rare earth oxide film having a thickness of less than 300 μm and an average surface roughness of less than 6 micro-inches.
1. A method of manufacturing an article comprising:
loading a ring shaped body into a deposition chamber, wherein the ring shaped body is a sintered ceramic body comprising a top flat region, a ring inner side and a ring outer side, wherein the ring inner side comprises a step and a vertical wall and the ring outer side is rounded;
performing ion assisted deposition to deposit a protective layer on at least the top flat region, the ring inner side and the ring outer side of the ring shaped body, wherein the protective layer is a plasma resistant rare earth oxide film having a first thickness of less than 300 μm on the top flat region and a second thickness on the vertical wall of the ring inner side, wherein the second thickness is 45-70% of the first thickness, and wherein the protective layer is a conformal layer having a porosity of less than or equal to about 0.1%; and
flame polishing the protective layer on the ring shaped body to an average surface roughness of below 6 micro-inches.
2. The method of claim 1 , wherein the protective layer is a ceramic film having a thickness of approximately 5-15 μm that comprises at least one of Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Er 2 O 3 , Gd 2 O 3 , Er 3 Al 5 O 12 , Gd 3 Al 5 O 12 , YF 3 , Nd 2 O 3 , Er 4 Al 2 O 9 , ErAlO 3 , Gd 4 Al 2 O 9 , GdAlO 3 , Nd 3 Al 5 O 12 , Nd 4 Al 2 O 9 , NdAlO 3 , or a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .
3. The method of claim 1 , further comprising:
performing the flame polishing to polish the protective layer to a roughness of 2-3 micro-inches.
4. The method of claim 1 , wherein the protective layer has a thickness of 10-12 μm, and where a deposition rate of 1-2 Angstroms per second is used to deposit the protective layer.
5. The method of claim 1 , further comprising:
heating the ring shaped body to a temperature of at least 150° C. prior to performing the ion assisted deposition; and
maintaining the temperature during the ion assisted deposition.
6. The method of claim 1 , wherein the ion assisted deposition is an electron beam ion assisted deposition, wherein a voltage of 150-270V and a current of 5-7 A are used to perform the electron beam ion assisted deposition.
7. The method of claim 1 , further comprising:
performing the ion assisted deposition to deposit a second protective layer on the protective layer, wherein the second protective layer is an additional plasma resistant rare earth oxide film having a thickness of 5-15 μm.
8. The method of claim 7 , wherein the protective layer comprises a coloring agent that causes the protective layer to have a different color than the second protective layer.
9. The method of claim 7 , wherein the protective layer is an amorphous layer comprising Y 3 Al 5 O 12 or Er 3 Al 5 O 12 and the second protective layer is a crystalline or polycrystalline layer comprising Er 2 O 3 or a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .
10. The method of claim 1 , wherein the article is usable at a temperature of 300° C. without causing cracking of the protective layer.
11. The method of claim 1 , wherein the protective layer is an amorphous layer after performing the ion assisted deposition, the method further comprising:
performing a heat treatment of the article after performing ion assisted deposition, wherein the heat treatment causes the protective layer to convert from the amorphous layer into a crystalline layer.
12. The method of claim 11 , wherein the heat treatment cause a transition layer to form between the ring shaped body and the protective layer.
13. The method of claim 1 , wherein the protective layer has a porosity of less than or equal to about 0.01%.