IP Library Granted Patent US 9,722,162
Granted Patent B2
US 9,722,162 · App. 15/056,339 · Granted Aug 1, 2017

Semiconductor light emitting device

Inventors: Koji Kaga (Komatsu Ishikawa, JP); Jumpei Tajima (Mitaka Tokyo, JP); Toshiyuki Oka (Kanazawa Ishikawa, JP); Kazuyuki Miyabe (Kanazawa Ishikawa, JP)
Assignee: Kabushiki Kaisha Toshiba
H01L33/62H01L27/153H01L33/36
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Quick Facts
Patent No.
US 9,722,162
App. No.
15/056,339
Granted
Aug 1, 2017
Kind
B2
Abstract

A semiconductor light emitting device includes first and second light emitting bodies, a first electrode, a second electrode and a first interconnection. The first and second light emitting bodies are disposed on a conductive substrate, and each includes first and second semiconductor layers and a light emitting layer therebetween. The first electrode is provided between the first light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer and the conductive substrate. The second electrode is provided between the second light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer. The first interconnection electrically connects the second semiconductor layer of the first light emitting body and the second electrode. The first interconnection includes a first portion extending over the first and second light emitting bodies and a second portion extending into the second light emitting body.

Claims (21)

1. A semiconductor light emitting device comprising:

a conductive substrate;

light emitting bodies disposed side by side on the conductive substrate, the light emitting bodies each including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, and the light emitting bodies including a first light emitting body electrically connected to the substrate and a second light emitting body electrically connected in series to the first light emitting body;

a first electrode provided between the first light emitting body and the conductive substrate, and electrically connected to the first semiconductor layer of the first light emitting body and the conductive substrate;

a second electrode provided between the second light emitting body and the conductive substrate, and electrically connected to the first semiconductor layer of the second light emitting body; and

a first interconnection electrically connecting the second semiconductor layer of the first light emitting body and the second electrode, the first interconnection including a first portion and a second portion, the first portion extending over the first light emitting body and the second light emitting body, and a second portion extending into the second light emitting body and being electrically connected to the second electrode.

2. The device according to claim 1 , further comprising:

an insulating layer provided between the second electrode and the conductive substrate.

3. The device according to claim 1 , further comprising:

an insulating layer having a first portion provided between the first electrode and the conductive substrate, and a second portion between the second electrode and the conductive substrate; and

a conductive body extending through the first portion of the insulating layer, and electrically connecting the first electrode and the conductive substrate.

4. The device according to claim 3 , wherein the conductive body is metal.

5. The device according to claim 1 , wherein

the second light emitting body includes a contact hole communicating with the second electrode; and

the second portion of the first interconnection is provided in the contact hole.

6. The device according to claim 1 , further comprising:

a third electrode electrically connected to a third light emitting body, the third light emitting body being included in the light emitting bodies, and connected in series to the second light emitting body, wherein the third electrode is provided between the third light emitting body and the conductive substrate, and is electrically connected to a first semiconductor layer of the third light emitting body; and

a second interconnection electrically connecting the second semiconductor layer of the second light emitting body and the third electrode, the second interconnection including a first portion and a second portion, the first portion of the second interconnection extending over the second light emitting body and the third light emitting body, and the second portion of the second interconnection extending through the third light emitting body and being electrically connected to the third electrode.

7. The device according to claim 1 , wherein the light emitting bodies further include a fourth light emitting body and a fifth light emitting body, the fourth light emitting body sharing the first electrode with the first light emitting body, and the fifth light emitting body being electrically connected in series to the fourth light emitting body.

8. The device according to claim 1 , wherein the first light emitting body and the second light emitting body are arranged on the conductive substrate with a spacing narrower than a distance from each of the first light emitting body and the second light emitting body to an outer periphery of the conductive substrate.

9. The device according to claim 1 , wherein the first interconnection has a stacked structure that includes a plurality of metal layers; and the plurality of metal layers include a gold layer that provides an outermost surface thereof.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: ALPAD CORPORATION
Reel/Frame 044258/0945 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2016
From: KAGA, KOJI; TAJIMA, JUMPEI; OKA, TOSHIYUKI; MIYABE, KAZUYUKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 038685/0273 →
Priority Claims (1)
JP 2015-178165 · Sep 10, 2015 · national
Continuity (1)
Related Publication 20170077366A1 · Mar 16, 2017