IP Library Granted Patent US 9,723,752
Granted Patent B2
US 9,723,752 · App. 14/277,807 · Granted Aug 1, 2017

Heat dissipating system

Inventors: Chang-Hsu Yen (Taipei, TW); Chien-Yu Lin (Taipei, TW)
Assignee: ASUSTeK COMPUTER INC.
H05K7/20172F04B43/046F04B45/047F04F7/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,723,752
App. No.
14/277,807
Granted
Aug 1, 2017
Kind
B2
Abstract

A heat dissipating system including a casing body, a heat source and a piezoelectric fan is provided. The casing body includes an upper casing and a bottom case, wherein at least one of the upper casing and the bottom casing includes at least one air inlet. The heat source and the piezoelectric fan are both disposed in the casing body. The piezoelectric fan has an opening facing the heat source while the air inlet is adjacent to the opening. Air is adsorbed into the opening through the air inlet and is exhausted out towards a direction of the heat source by the piezoelectric fan.

Claims (10)

1. A heat dissipating system, comprising:

a casing body having an upper casing and a bottom casing, and at least one of the upper casing and the bottom casing includes at least one air inlet;

a heat source disposed in the casing body; and

a piezoelectric fan disposed in the casing body and having an opening, the opening faces the heat source, and the air inlet is adjacent to the opening, air draw into the opening through the air inlet, and exhaust out towards a direction to the heat source by the piezoelectric fan, wherein an orthographic projected image of the opening on the bottom casing is overlapped with an orthographic projected image of the air inlet on the bottom casing.

2. The heat dissipating system according to claim 1 , wherein an orthographic projected image of the air inlet overlaps partially of that of the piezoelectric fan.

3. The heat dissipating system according to claim 1 , wherein an orthographic projected image of the heat source overlaps that of the air inlet.

4. The heat dissipating system according to claim 1 , wherein an orthographic projected image of the heat source does not overlap that of the air inlet.

5. The heat dissipating system according to claim 1 , wherein at least one of the upper casing and the bottom casing has at least one air outlet, the distance between the air outlet and the opening is larger than the distance between the air inlet and the opening.

6. The heat dissipating system according to claim 5 , wherein the heat source is between the air inlet and the air outlet.

7. The heat dissipating system according to claim 5 , wherein both the upper casing and the bottom casing of the casing body have the air inlet and the air outlet.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2014
From: YEN, CHANG-HSU; LIN, CHIEN-YU
To: ASUSTEK COMPUTER INC.
Reel/Frame 032935/0520 →
Priority Claims (1)
TW 102117397 A · May 16, 2013 · national
Continuity (1)
Related Publication 20140338868A1 · Nov 20, 2014