Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device may include forming split gate structures including a floating gate electrode layer and a control gate electrode layer in a cell region of a substrate including the cell region and a logic region adjacent to the cell region. The method may include sequentially forming a first gate insulating film and a metal gate film in the logic region and the cell region, removing the metal gate film from at least a portion of the cell region and the logic region, forming a second gate insulating film on the first gate insulating film from which the metal gate film has been removed, forming a gate electrode film on the logic region and the cell region, and forming a plurality of memory cell elements disposed in the cell region and a plurality of circuit elements disposed in the logic region.
1. A method of manufacturing a semiconductor device, the method comprising:
forming split gate structures, each including a floating gate electrode layer and a control gate electrode layer in a cell region of a substrate, the substrate including the cell region and a logic region adjacent to the cell region;
sequentially forming a first gate insulating film and a metal gate film in the logic region and the cell region;
removing the metal gate film from at least a portion of the cell region and the logic region;
forming a second gate insulating film on the first gate insulating film from which the metal gate film has been removed;
forming a gate electrode film on the logic region and the cell region; and
forming a plurality of memory cell elements disposed in the cell region and a plurality of circuit elements disposed in the logic region by patterning the first and second gate insulating films, the gate electrode film, and a residue of the metal gate film.
2. The method of claim 1 , wherein the logic region includes a first region adjacent to the cell region and a second region adjacent to the first region.
3. The method of claim 2 , wherein the removing removes the metal gate film in the first region and the at least a portion of the cell region, while the metal gate film remains in the second region.
4. The method of claim 3 , wherein a gate electrode formed in the first region and a gate electrode formed in the second region have different widths.
5. The method of claim 2 , wherein the removing removes the metal gate film in the at least a portion of the cell region, while the metal gate film remains in the first region and the second region.
6. The method of claim 1 , wherein the forming a plurality of gate electrodes includes:
forming an erase gate electrode between the split gate structures; and
forming a select gate electrode on an outside of each of the split gate structures.
7. The method of claim 1 , wherein the removing comprises:
performing a wet-etching process in which the metal gate film is removed in at least a portion of the logic region and the cell region, the wet-etch process using an etching solution containing an SC 1 solution.
8. The method of claim 1 , wherein the removing removes a portion of the metal gate film enclosing one end of the control gate electrode layer in an edge of the cell region.
9. The method of claim 1 , wherein the first gate insulating film contains at least one of an aluminum oxide (Al 2 O 3 ), a tantalum oxide (Ta 2 O 3 ), a titanium oxide (TiO 2 ), an yttrium oxide (Y 2 O 3 ), a zirconium oxide (ZrO 2 ), a zirconium silicon oxide (ZrSi x O y ), a hafnium oxide (HfO 2 ), a hafnium silicon oxide (HfSi x O y ), a lanthanum oxide (La 2 O 3 ), a lanthanum aluminum oxide (LaAl x O y ), a lanthanum hafnium oxide (LaHf x O y ), a hafnium aluminum oxide (HfAl x O y ), and a praseodymium oxide (Pr 2 O 3 ).
10. A method of manufacturing a semiconductor device having a split gate structure, the method comprising:
forming a split gate structure on a substrate, the substrate including a cell region and a logic region;
sequentially forming a first gate insulating film and a metal gate film on the split gate structures;
removing a portion of the metal gate film;
forming a second gate insulating film on the first gate insulating film;
forming a gate electrode film on the cell region and the logic region; and
forming an insulating layer, a first circuit element, a second circuit element, and a bit line on the substrate.
11. The method of claim 10 , further comprising:
injecting an impurity in a partial region of the substrate between the split gate structures to form a first impurity region.
12. The method of claim 11 , further comprising:
oxidizing the partial region of the substrate to form an oxide layer on the first impurity region.
13. The method of claim 12 , wherein the oxide layer includes a central portion that is bulged.
14. The method of claim 10 , wherein the removing a portion of the metal gate film completely removes the metal gate film in the cell region.
15. The method of claim 10 , wherein the forming a split gate structure comprises:
forming a floating gate electrode and a control gate electrode in the cell region of the substrate.