III-V HEMT devices
A semiconductor device has a stacked structure in which a p-GaN layer, an SI-GaN layer, and an AlGaN layer are stacked, and has a gate electrode that is formed at a top surface side of the AlGaN layer. A band gap of the AlGaN layer is wider than a band gap of the p-GaN layer and the SI-GaN layer. Moreover, impurity concentration of the SI-GaN layer is less than 1×10 17 cm −3 . Semiconductor devices including III-V semiconductors may have a stable normally-off operation.
1. A transistor comprising:
a first layer including a first III-V nitride semiconductor, the first layer being a channel layer;
a second layer stacked on a top surface of the first layer and including a second III-V nitride semiconductor, the second layer being an electron supply layer;
a surface layer stacked on a top surface of the second layer and including a III-V nitride semiconductor having a first conductivity type; and
a gate electrode formed at a top surface side of the surface layer;
wherein:
the second layer has one of a second conductivity type opposite to the first conductivity type or a semi-insulating type,
a band gap of the second III-V nitride semiconductor is wider than a band gap of the first III-V nitride semiconductor,
two dimensional electron gas is generated within the first layer during on state, and
at least the second layer that is located under the gate electrode and is configured to include a thickness that is to be substantially depleted, forming a depletion region extending from a junction between the surface layer and the second layer to the first layer along a stack direction, when zero voltage is applied to the gate electrode.
2. The transistor as defined in claim 1 , wherein the III-V nitride semiconductor in the surface layer is the second III-V nitride semiconductor.
3. A transistor comprising:
a first layer including a first III-V nitride semiconductor, the first layer being a channel layer;
a plurality of units of layers, wherein:
each of the units of layers comprises a second layer and an upper layer stacked on a top surface of the second layer,
each of the units of layers is stacked on a top surface of a lower unit of layers,
the second layer includes a second III-V nitride semiconductor, and
the upper layer includes a III-V nitride semiconductor having a first conductivity type; and
a gate electrode formed at a top surface side of the uppermost unit of layers;
wherein:
the second layer has one of a second conductivity type opposite to the first conductivity type or a semi-insulating type, the second layer being an electron supply layer,
a band gap of the second III-V nitride semiconductor is wider than a band gap of the first III-V nitride semiconductor,
two-dimensional electron gas is generated within the first layer during on state, and
at least the second layer that is located under the gate electrode and is configured to include a thickness that is to be substantially depleted, forming a depletion region extending from a junction between a surface layer and the second layer to the first layer along a stack direction, when zero voltage is applied to the gate electrode.
4. The transistor as defined in claim 3 , wherein the III-V nitride semiconductor in the upper layer is the second III-V nitride semiconductor.