MEMS capacitive pressure sensors

1. A MEMS capacitive pressure sensor, comprising:

a substrate having a first region and a second region surrounding the device region;

a first dielectric layer formed on the substrate;

a second dielectric layer having a step surface profile formed on the first dielectric layer;

a first electrode layer having a step surface profile formed on the second dielectric layer and the first dielectric layer;

an insulation layer formed on the first electrode layer; a second electrode layer having a step surface profile with a portion formed on the insulation layer in the peripheral region and the rest suspended over the first electrode layer in the device region; and

a chamber having a step surface profile formed between the first electrode layer and the second electrode layer, wherein a projection of the step surface profile of the second dielectric layer on the substrate is a plurality of concentric circles, a plurality of concentric squares or a plurality of concentric polygons.

2. The MEMS capacitive pressure sensor according to claim 1 , wherein the second dielectric layer having a step surface profile is formed by:

forming a second dielectric thin film on the first dielectric layer;

forming a patterned photoresist layer on the second dielectric thin film;

etching the second dielectric thin film to form a second dielectric layer;

etching the second dielectric layer with a reduced patterned photoresist layer as an etching mask to form a second dielectric layer having a first step layer with a predetermined depth;

etching the second dielectric layer having the first step layer to form a second dielectric layer having the first step layer and a second step layer using a further reduced patterned photoresist layer as an etching mask; and

repeating the etching process with further a reduced patterned photoresist layer as an etching mask until the second dielectric layer having the step surface profile has a predetermined number of step layers.

3. The MEMS capacitive pressure sensor according to claim 1 , wherein the substrate further includes:

a plurality of semiconductor devices and electrical interconnection structures inside, or on one surface.

4. The MEMS capacitive pressure sensor according to claim 3 , wherein the first dielectric layer further includes:

a plurality of conductive vias or trench structures connecting the first electrode layer with the substrate, or the semiconductor devices in the substrate.

5. The MEMS capacitive pressure sensor according to claim 1 , further including:

a third dielectric layer on the second electrode layer; and

an opening in the third dielectric layer exposing a portion of the second electrode layer in the device region.

6. The MEMS capacitive pressure sensor according to claim 5 , wherein the third dielectric layer further includes:

a first conductive via connecting with the first electrode layer; and

a second conductive via connecting with the second electrode layer.

7. The MEMS capacitive pressure sensor according to claim 1 , wherein:

the first region is a device region; and

the second region is peripheral region.

8. The MEMS capacitive pressure sensor according to claim 7 , wherein:

the first electrode layer is on a surface of the first dielectric layer in the device region and the peripheral region;

a portion of the second electrode layer is on a surface of the insulation layer in the peripheral region; and

the rest of the second electrode layer is suspended over the first electrode layer in the device region.

9. The MEMS capacitive pressure sensor according to claim 1 , further including:

an etching stop layer on the first dielectric layer; and a fourth dielectric layer on the second electrode layer.

10. The MEMS capacitive pressure sensor according to claim 1 , wherein:

the first dielectric layer is made of SiN or SiCN;

the first electrode layer and the second electrode layer are made of one or more of TiN, Ti, TaN, Ta, W, TiC, TaC and La; and

the second dielectric layer is made of SiO 2 , SiN, SiON, SiCN or low dielectric constant material.

11. The MEMS capacitive pressure sensor according to claim 1 , wherein the chamber is formed between the insulation layer and the second electrode layer.

12. The MEMS capacitive pressure sensor according to claim 1 , wherein the second dielectric layer is fully covered by the first electrode layer.