Flexible electronic device
According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.
1. A flexible electronic device, comprising:
a flexible substrate;
at least one component disposed on the flexible substrate and having a lateral surface; and
at least one stress buffer disposed adjacent to the lateral surface of the component, wherein the stress buffer has a stiffness which is getting larger toward the component,
wherein the stiffness of the stress buffer is less than a stiffness of the component,
wherein the stress buffer has a thickness which is getting larger toward the component, and
wherein the stress buffer has an outer surface, and a distance between the outer surface and the flexible substrate is getting smaller toward the component.
2. The flexible electronic device according to claim 1 , wherein the component is an electronic component.
3. The flexible electronic device according to claim 2 , wherein the electronic component comprises a chip and a molding compound enveloping the chip, and the stress buffer is a portion of the molding compound.
4. The flexible electronic device according to claim 1 , wherein the component is a sealing material, a filling material, or a side wall barrier.
5. The flexible electronic device according to claim 4 , wherein the flexible substrate has a display area, and the component surrounds the display area.
6. The flexible electronic device according to claim 1 , wherein the stress buffer contacts with the component.
7. The flexible electronic device according to claim 1 , wherein the stress buffer is separated from the component, and an interval between the lateral surface of the component and the stress buffer is less than or equal to a thickness of the component.
8. The flexible electronic device according to claim 1 , wherein the stress buffer has a width which is getting larger toward the component.
9. The flexible electronic device according to claim 1 , wherein the outer surface is a curved surface or a plane.
10. The flexible electronic device according to claim 1 , wherein the stress buffer has a lower surface, and the entire lower surface contacts the flexible substrate.
11. A flexible electronic device, comprising:
a flexible substrate;
at least one component disposed on the flexible substrate and having a lateral surface; and
at least one stress buffer disposed adjacent to the lateral surface of the component,
wherein the stress buffer has a stiffness which is getting larger toward the component,
wherein the stiffness of the stress buffer is equal to or less than a stiffness of the flexible substrate and less than a stiffness of the component, and
wherein the stress buffer comprises a buffer body, a plurality of voids and a plurality of smaller voids, wherein the buffer body comprises a front portion and a rear portion, the rear portion is closer to the component than the front portion, the voids are distributed within the front portion of the buffer body, and the smaller voids are distributed within the rear portion of the buffer body.
12. A flexible electronic device, comprising:
a flexible substrate;
at least one component disposed on the flexible substrate and having a lateral surface; and
at least one stress buffer disposed adjacent to the lateral surface of the component,
wherein the stress buffer has a stiffness which is getting larger toward the component,
wherein the stiffness of the stress buffer is equal to or less than a stiffness of the flexible substrate and less than a stiffness of the component, and
wherein the stress buffer comprises a buffer body, the buffer body comprising a front portion, a rear portion and a plurality of voids distributed within the buffer body, the rear portion is closer to the component than the front portion, and a density of the voids distributed within the rear portion of the buffer body is larger than a density of the voids distributed within the front portion of the buffer body.
13. A flexible electronic device, comprising:
a flexible substrate;
at least one component disposed on the flexible substrate and having a lateral surface; and
at least one stress buffer disposed adjacent to the lateral surface of the component,
wherein the stress buffer has a stiffness which is getting larger toward the component,
wherein the stiffness of the stress buffer is equal to or less than a stiffness of the flexible substrate and less than a stiffness of the component,
wherein the stress buffer comprises a flexible structure and an adhesive, and the adhesive is disposed between the flexible substrate and the flexible structure, and the adhesive directly connects the flexible substrate and the flexible structure, and
wherein the adhesive is disposed on a rear portion of the flexible structure, and there is a space formed between a front portion of the flexible structure and the flexible substrate.
14. The flexible electronic device according to claim 1 , wherein the stiffness of the stress buffer is equal to or less than the stiffness of the flexible substrate.
15. A flexible electronic device, comprising:
a flexible substrate;
at least one component disposed on the flexible substrate and having a lateral surface; and
a plurality of stress buffers only disposed adjacent to the lateral surface of the component, wherein each of the stress buffers has a stiffness which is getting larger toward the component,
wherein the stiffness of each of the stress buffers is equal to or less than a stiffness of the flexible substrate and less than a stiffness of the component,
wherein each of the stress buffers has a width which is getting larger toward the component, and each of the stress buffers has a fixed thickness.